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MMSZ4697
MMSZ4697
General Description
Half watt, General purpose, Medium Current Surface
Mount Zener in the SOD-123 package. The SOD-123
package has the same footprint as the glass mini-melf (LL-
34) package & provides a convenient alternative to the
Leadless package.
Features
• Compact surface mount with same footprint as mini-melf
• 500mW rating on FR-4 or FR-5 board.
• Class 3 ESD rating (>16kV) per Human Body Model
Ordering
• 7 inch reel (178mm); 8mm Tape; 3,000 units per reel.
Absolute Maximum Ratings
(Note 1)
T
A
=25°C unless otherwise noted
Symbol
T
STG
T
J
P
D
R
∅JA
R
∅JL
∆V
Z
Storage Temperature
Maximum Junction Temperature
Total Power Dissipation at 25°C
Derate above 25°C
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Lead
Maximum Voltage Change
(Note 2)
Parameter
Value
-55 ~ 150
-55 ~ 150
500
6.7
340
150
100
260
10
Units
°C
°C
mW
mW/°C
°C/W
°C/W
mV
°C
V
Lead Solder Temperature (Max 10 second duration)
Nominal Zener Voltage (V
Z
) at 50µA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Note 2: Voltage change is equal to the difference between V
Z
at 100µA and V
Z
at 10µA.
Top Mark: DE
1: Cathode
2: Anode
1
2
Electrical Characteristics
T
A
=25°C unless otherwise noted
Symbol
V
Z
I
R
V
F
∆V
Z
Characteristics
Zener Voltage
Reverse Leakage
Forward Voltage
Delta Zener Voltage
(Note 2)
Test Conditions
I
ZT
= 50µA
D.C
V
R
= 7.6V
I
F
= 10mA
I
ZT
= 100µA to 10µA
Min.
9.50
Max.
10.50
1.0
900
100
Units
V
µA
mV
mV
©2004 Fairchild Semiconductor Corporation
MMSZ4697, Rev. A
MMSZ4697
SOD-123 PACKAGE
PACKAGE CODE = (D6)
Fairchild Semiconductor's Criteria
Corrected March 11, 1998
Actual Size
DIM
2
1
A
MIN
(mils)
55
100
34.6
141.7
----
21.5
0.5
12.7
3.7
MAX
(mils)
71
112
46
153.5
----
27.5
4
----
7.7
A
MIN
(mm)
1.400
2.550
0.880
3.600
-------
0.546
0.322
0.095
MAX
(mm)
1.800
2.850
1.180
3.900
-------
0.70
-------
0.195
A
B
C
D
B
E
F
G
0.0135 0.1015
D
H
I
I
C
H
F
G
1.2 2 mm
48 mils
0.91 mm
36 mils
2.36 mm
93 mils
4.19 mm
165 mils
0.91 mm
36 mils
SOD-123 LAND PADS
©2004 Fairchild Semiconductor Corporation
MMSZ4697, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
FACT Quiet Series™
ActiveArray™
FAST
Bottomless™
FASTr™
CoolFET™
FPS™
CROSSVOLT™
FRFET™
DOME™
GlobalOptoisolator™
EcoSPARK™ GTO™
E
2
CMOS
TM
HiSeC™
EnSigna
TM
I
2
C™
FACT™
ImpliedDisconnect™
Across the board. Around the world.™
The Power Franchise™
Programmable Active Droop™
DISCLAIMER
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerSaver™
PowerTrench
QFET
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER
SMART START™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic
TINYOPTO™
TruTranslation™
UHC™
UltraFET
VCX™
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or
In Design
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I8
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