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IDT7014S12J

产品描述Dual-Port SRAM, 4KX9, 12ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
产品类别存储    存储   
文件大小72KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT7014S12J概述

Dual-Port SRAM, 4KX9, 12ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52

IDT7014S12J规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码LCC
包装说明0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
针数52
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间12 ns
I/O 类型COMMON
JESD-30 代码S-PQCC-J52
JESD-609代码e0
长度19.1262 mm
内存密度36864 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端口数量2
端子数量52
字数4096 words
字数代码4000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4KX9
输出特性3-STATE
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC52,.8SQ
封装形状SQUARE
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源5 V
认证状态Not Qualified
座面最大高度4.572 mm
最大压摆率0.25 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度19.1262 mm

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HIGH-SPEED
4K x 9 DUAL-PORT
STATIC RAM
Integrated Device Technology, Inc.
IDT7014S
FEATURES:
• True Dual-Ported memory cells which allow simultaneous
access of the same memory location
• High-speed access
— Military: 20/25/35ns (max.)
— Commercial: 12/15/20/25ns (max.)
• Low-power operation
— IDT7014S
Active: 900mW (typ.)
• Fully asynchronous operation from either port
• TTL-compatible; single 5V (±10%) power supply
• Available in 52-pin PLCC and a 64-pin TQFP
• Industrial temperature range (–40°C to +85°C) is avail-
able, tested to military electrical specifications
DESCRIPTION:
The IDT7014 is an extremely high-speed 4K x 9 Dual-Port
Static RAM designed to be used in systems where on-chip
hardware port arbitration is not needed. This part lends itself
to high-speed applications which do not need on-chip arbitra-
tion to manage simultaneous access.
The IDT7014 provides two independent ports with separate
control, address, and I/O pins that permit independent,
asynchronous access for reads or writes to any location in
memory. See functional description.
The IDT7014 utilitizes a 9-bit wide data path to allow for
parity at the user's option. This feature is especially useful in
data communication applications where it is necessary to use
a parity bit for transmission/reception error checking.
Fabricated using IDT’s high-performance technology, the
IDT7014 Dual-Ports typically operate on only 900mW of
power at maximum access times as fast as 12ns.
The IDT7014 is packaged in a 52-pin PLCC and a 64-pin
thin plastic quad flatpack (TQFP).
FUNCTIONAL BLOCK DIAGRAM
R/
W
L
R/
W
R
OE
L
I/O
0L
- I/O
8L
COLUMN
CONTROL
COLUMN
CONTROL
OE
R
I/O
0R
- I/O
8R
A
0L
- A
11L
LEFT SIDE
ADDRESS
DECODE
LOGIC
MEMORY
ARRAY
RIGHT SIDE
ADDRESS
DECODE
LOGIC
A
0R
- A
11R
2528 drw 01
The IDT logo is a registereed trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
©1996 Integrated Device Technology, Inc.
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
OCTOBER 1996
DSC-2528/6
6.11
1

IDT7014S12J相似产品对比

IDT7014S12J IDT7014S20PF IDT7014S12PF IDT7014S15PF IDT7014S35J
描述 Dual-Port SRAM, 4KX9, 12ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 4KX9, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 Dual-Port SRAM, 4KX9, 12ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 Dual-Port SRAM, 4KX9, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 Dual-Port SRAM, 4KX9, 35ns, PQCC52, PLASTIC, LCC-52
零件包装代码 LCC QFP QFP QFP LCC
包装说明 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 QCCJ,
针数 52 64 64 64 52
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 20 ns 12 ns 15 ns 35 ns
JESD-30 代码 S-PQCC-J52 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQCC-J52
JESD-609代码 e0 e0 e0 e0 e0
长度 19.1262 mm 14 mm 14 mm 14 mm 19.1262 mm
内存密度 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9 9
功能数量 1 1 1 1 1
端子数量 52 64 64 64 52
字数 4096 words 4096 words 4096 words 4096 words 4096 words
字数代码 4000 4000 4000 4000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
组织 4KX9 4KX9 4KX9 4KX9 4KX9
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ LQFP LQFP LQFP QCCJ
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.572 mm 1.6 mm 1.6 mm 1.6 mm 4.57 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) TIN LEAD
端子形式 J BEND GULL WING GULL WING GULL WING J BEND
端子节距 1.27 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD
宽度 19.1262 mm 14 mm 14 mm 14 mm 19.1262 mm
是否无铅 含铅 含铅 含铅 含铅 -
是否Rohs认证 不符合 不符合 不符合 不符合 -
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
I/O 类型 COMMON COMMON COMMON COMMON -
湿度敏感等级 3 3 3 3 -
端口数量 2 2 2 2 -
输出特性 3-STATE 3-STATE 3-STATE 3-STATE -
可输出 YES YES YES YES -
封装等效代码 LDCC52,.8SQ QFP64,.66SQ,32 QFP64,.66SQ,32 QFP64,.66SQ,32 -
峰值回流温度(摄氏度) 225 240 240 240 -
电源 5 V 5 V 5 V 5 V -
最大压摆率 0.25 mA 0.245 mA 0.25 mA 0.25 mA -
处于峰值回流温度下的最长时间 30 20 20 20 -

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