1MX8 MASK PROM CARD, 200ns, XMA40
| 参数名称 | 属性值 |
| 厂商名称 | Seiko Epson Corporation |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| JESD-30 代码 | X-XXMA-X40 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | MASK ROM CARD |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 60 °C |
| 最低工作温度 | |
| 组织 | 1MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | UNSPECIFIED |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | UNSPECIFIED |
| 端子位置 | UNSPECIFIED |
| MRC100IEC0 | MRC200IEC0 | MRC128IEC0 | MRC512IEC0 | MRC256IEC0 | |
|---|---|---|---|---|---|
| 描述 | 1MX8 MASK PROM CARD, 200ns, XMA40 | 2MX8 MASK PROM CARD, 220ns, XMA40 | 128KX8 MASK PROM CARD, 200ns, XMA40 | 512KX8 MASK PROM CARD, 200ns, XMA40 | 256KX8 MASK PROM CARD, 200ns, XMA40 |
| 厂商名称 | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 220 ns | 200 ns | 200 ns | 200 ns |
| JESD-30 代码 | X-XXMA-X40 | X-XXMA-X40 | X-XXMA-X40 | X-XXMA-X40 | X-XXMA-X40 |
| 内存密度 | 8388608 bit | 16777216 bit | 1048576 bit | 4194304 bit | 2097152 bi |
| 内存集成电路类型 | MASK ROM CARD | MASK ROM CARD | MASK ROM CARD | MASK ROM CARD | MASK ROM CARD |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 40 | 40 | 40 |
| 字数 | 1048576 words | 2097152 words | 131072 words | 524288 words | 262144 words |
| 字数代码 | 1000000 | 2000000 | 128000 | 512000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 60 °C | 60 °C | 60 °C | 60 °C | 60 °C |
| 组织 | 1MX8 | 2MX8 | 128KX8 | 512KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
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