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IDT75T54100S66BS304

产品描述Microprocessor Circuit, CMOS, PBGA304, 31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小97KB,共11页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT75T54100S66BS304概述

Microprocessor Circuit, CMOS, PBGA304, 31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304

IDT75T54100S66BS304规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明LBGA,
针数304
Reach Compliance Codeunknown
JESD-30 代码S-PBGA-B304
JESD-609代码e0
长度31 mm
端子数量304
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
认证状态Not Qualified
座面最大高度1.7 mm
最大供电电压2.625 V
最小供电电压2.375 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度31 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR CIRCUIT

文档预览

下载PDF文档
Initialization of IDT75T54100
IP Co-Processor
Initialization of IDT's
IP Co-Processor 75P52100 Device
Initialization of
Application Note AN-268
Application Note AN-268
Application
IDT75T54100
IP Co-Processor
Overview
This application note "Initialization of IDT75T54100 IP Co-Processor"
device describes how to initialize the IPC from power up. A single
IDT75T54100 device can be used or multiple devices can be grouped
together for depth expansion. The first part of this application note will
discuss how to initialize a single device. It will explain the initialization
procedure required in a chronological order and discuss the features that
are selectable by the user. The second part of this application note will
explain the differences in the initialization sequence required when
hooking up multiple devices in a depth expanded IPC system.
Note
AN-268
Background Information
The IPC (Internet Protocol Co-Processor) family was developed for
a wide range of communication and networking applications. The IPC
family is intended for use in applications that require high speed data
searching such as routers, high layer switching and in the convergence
of voice, data, and video.
The IDT75T54100 is part of IPC family of products and is a high
performance pipelined, synchronous 64K x 72 IPC. It utilizes content
addressable memory technology to perform pattern recognition functions.
Each location in the IPC has a Data entry. The IPC has a 72-bit bi-
directional bus, which is a 16-bit multiplexed address and 72-bit data bus
that can support 66 million lookups per second. Refer to the IDT75T54100
Datasheet for a full device description.
Figure 1.0 Single IPC Device
RST
REQ STB
PHASEN
CLK2X
COMM AND BUS [6:0]
VDD
CONFIG IN
CE/OE
WE
INDEX BUS [20:0]
REQ UEST BUS [71:0]
ID T 's IP C
75T54100
M ATCHIN
M ATCHIN
M ATCHIN
M ATCHIN
M ATCHIN
M ATCHIN
M ATCHIN
0
1
2
3
4
5
6
GND
RDACK
HITACK
VALID
5 3 3 1 d rw 0 1
MATCHOUT
CONFIGO UT
MAY 2001
6.42
1
©2001 Integrated Device Technology, Inc.
DSC-5331/00

IDT75T54100S66BS304相似产品对比

IDT75T54100S66BS304 IDT75T54100S50BS304
描述 Microprocessor Circuit, CMOS, PBGA304, 31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304 Microprocessor Circuit, CMOS, PBGA304, 31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA
包装说明 LBGA, LBGA,
针数 304 304
Reach Compliance Code unknown unknown
JESD-30 代码 S-PBGA-B304 S-PBGA-B304
JESD-609代码 e0 e0
长度 31 mm 31 mm
端子数量 304 304
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
认证状态 Not Qualified Not Qualified
座面最大高度 1.7 mm 1.7 mm
最大供电电压 2.625 V 2.625 V
最小供电电压 2.375 V 2.375 V
标称供电电压 2.5 V 2.5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD
端子形式 BALL BALL
端子节距 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM
宽度 31 mm 31 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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