8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, VQFN-64
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 64 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大模拟输入电压 | 4.45 V |
最小模拟输入电压 | -3 V |
最长转换时间 | 0.65 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-PQCC-N64 |
JESD-609代码 | e4 |
长度 | 9 mm |
最大线性误差 (EL) | 0.0011% |
湿度敏感等级 | 3 |
标称负供电电压 | -5 V |
模拟输入通道数量 | 8 |
位数 | 16 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
采样速率 | 1 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 1 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 9 mm |
ADS8255IBRGCR | ADS8255IRGCR | ADS8255IRGCT | ADS8255IBRGCT | |
---|---|---|---|---|
描述 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, VQFN-64 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, VQFN-64 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, VQFN-64 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, VQFN-64 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
针数 | 64 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 4.45 V | 4.45 V | 4.45 V | 4.45 V |
最小模拟输入电压 | -3 V | -3 V | -3 V | -3 V |
最长转换时间 | 0.65 µs | 0.65 µs | 0.65 µs | 0.65 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 9 mm | 9 mm | 9 mm | 9 mm |
最大线性误差 (EL) | 0.0011% | 0.0023% | 0.0023% | 0.0011% |
湿度敏感等级 | 3 | 3 | 3 | 3 |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V |
模拟输入通道数量 | 8 | 8 | 8 | 8 |
位数 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 9 mm | 9 mm | 9 mm | 9 mm |
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