Bus Transceiver, ACT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDIP20, PLASTIC, DIP-20
参数名称 | 属性值 |
厂商名称 | AVG [AVG Semiconductors(HITEK)] |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 20 |
Reach Compliance Code | unknown |
其他特性 | WITH DIRECTION CONTROL |
系列 | ACT |
JESD-30 代码 | R-PDIP-T20 |
长度 | 26.415 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS TRANSCEIVER |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 9 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
DV74ACT640N | DV74ACT640D | DV74AC640D | DV74AC640N | |
---|---|---|---|---|
描述 | Bus Transceiver, ACT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDIP20, PLASTIC, DIP-20 | Bus Transceiver, ACT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, PLASTIC, SOP-20 | Bus Transceiver, AC Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, PLASTIC, SOP-20 | Bus Transceiver, AC Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDIP20, PLASTIC, DIP-20 |
厂商名称 | AVG [AVG Semiconductors(HITEK)] | AVG [AVG Semiconductors(HITEK)] | AVG [AVG Semiconductors(HITEK)] | AVG [AVG Semiconductors(HITEK)] |
零件包装代码 | DIP | SOIC | SOIC | DIP |
包装说明 | DIP, | SOP, | SOP, | DIP, |
针数 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
系列 | ACT | ACT | AC | AC |
JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
长度 | 26.415 mm | 12.8 mm | 12.8 mm | 26.415 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
传播延迟(tpd) | 9 ns | 9 ns | 9.5 ns | 9.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 2.65 mm | 2.65 mm | 4.57 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 6 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved