128 K x 32 Flash Module
PUMA68FV4006X - 70/90/12
Issue 5.0 January 2000
Description
The PUMA68 range of devices provide a high density
surface mount industry standard memory solution
which may accommodate various memory
technologies including SRAM, EEPROM and Flash.
The devices are designed to offer a defined upgrade
path and may be user configured as 8, 16 or 32 bits
wide.
The PUMA68FV4006X is a 128Kx32 3. FLASH
module housed in a 68 Jleaded package which
complies with the JEDEC 68 PLCC standard.
Access times of 70, 90 or 120ns are available. The
3.3V device is available to commercial and industrial
temperature grade.
512K x 32, 1M x 32 and 2Mx32 FLASH PUMA68
devices are available in the same footprint to offer a
defined upgrade path.
Block Diagram
A0~A16
/OE
/WE
128K x 8
FLASH
/CS1
/CS2
/CS3
/CS4
D0~7
D8~15
D16~23
D24~31
128K x 8
FLASH
128K x 8
FLASH
128K x 8
FLASH
Features
• Access times of 70, 90 and 120ns.
• 3.3V + 10%.
• Commercial and Industrial temperature grades
• JEDEC Standard 68 PLCC footprint.
• Industry standard pinout.
• User configurable as 8 / 16 / 32 bits wide.
• 10 Year Data Retention
• Write Erase Cycle Endurance 100,000 (min)
• Automatic Write/Erase by Embedded Algorithm
• Uniform Sector Device.
Pin Definition
See page 2.
Pin Functions
Description
Address Input
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power
Ground
Signal
A0~A16
D0~D31
/CS1~4
/WE
/OE
NC
V
CC
V
SS
Package Details
Plastic ‘J’ Leaded JEDEC PLCC
Max. Dimensions (mm) - 25.27 x 25.27 x 5.08
11403 West Bernardo Court, Suite 100, San Diego, CA92127.
TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail:
sales@mosaicsemi.com
Pin Definition - PUMA68FV4006X
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Signal
V
CC
NC
/CS1
/CS2
/CS3
/CS4
NC
NC
D16
D17
D18
D19
V
SS
D20
D21
D22
D23
V
CC
D24
D25
D26
D27
V
SS
D28
D29
D30
D31
A6
A5
A4
A3
A2
A1
A0
Pin
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Signal
V
CC
A13
A12
A11
A10
A9
A8
A7
D0
D1
D2
D3
V
SS
D4
D5
D6
D7
V
CC
D8
D9
D10
D11
V
SS
D12
D13
D14
D15
A14
A15
A16
/WE
/OE
NC
NC
PAGE 2
Issue 5.0 January 2000
Package Details
PUMA 68 pin JEDEC Surface Mounted PLCC
Pin 1
Pin 68
25.27 (0.995)
25.02 (0.985)
5.08
(0.200)
max
0.46
(0.018)
1.27 (0.050)
0.90
(0.035)
typ
23.11 (0.910)
24.13 (0.950)
PAGE 3
Issue 5.0 January 2000
Ordering Information
Ordering Information
PUMA 68FV4006XI - 70
Speed
70
90
12
Blank
I
=
=
=
=
=
70ns
90ns
12ns
Commercial
Industrial
Temp. Range/Screening
Pinout Configuration
Memory Organisation
X = Industry Standard
Pinout
4006 = configurable as
128K x 8, 256K x 16 or
512K x 8
FV = FLASH, 3.3V+10% V
CC
PUMA 68 = 68 pin ‘J’ Leaded PLCC
Technology
Package
Note :
Although this data is believed to be accurate the information contained herein is not intended to and does not create
any warranty of merchantibility or fitness for a particular purpose.
Our products are subject to a constant process of development. Data may be changed without notice.
Products are not authorised for use as critical components in life support devices without the express written
approval of a company director.
PAGE 4
http://www.mosaicsemi.com/
Issue 5.0 January 2000
Customer Guidelines
Co Planarity
Specified as +/- 2 thou max.
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are
moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40
O
C and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220
O
C)
must be
:
A : Mounted within 72 Hours at factory conditions of <30
O
C/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23
O
C +/-5% devices
require baking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125
O
C +/-5% for high temperature device containers
OR
B : 192 hours at 40
O
C +5
O
C/-0
O
C and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
Temp. exceeding 183
O
C
Peak Temperature
Time within 5
O
C of peak
Ramp down
Ramp up rate
Peak Temperature
Time within 5
O
C of peak
Ramp down
6
O
C/sec max.
150 secs. max.
225
O
C
20 secs max.
6
O
C/sec max.
6
O
C/sec max.
215 - 219
O
C
60 secs max.
6
O
C/sec max.
Vapour Phase -
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
PAGE 5
Issue 5.0 December 1999
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