MMSZ5221B-MMSZ5260B
Zener
Diode
FEATURES
Planar Die Construction
Ultra-Small Surface Mount Package
General purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
SOD-123 Plastic-Encapsulate
MAXIMUM RATINGS
T
A
=
25°C unless otherwise specified
01/14/2007 Rev. 1.00
www.SiliconStandard.com
1
MMSZ5221B-MMSZ5260B
Notes:
1. Device mounted on ceramic PCB;7.6mm x 9.4mm0.87mm with pad areas 25 mm2.
2. Tested with pulses, Tp≤1.0ms.
TYPICAL CHARACTERISTICS
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard
Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness
of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property
rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary
to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design.
No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use
of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any
third parties.
Disclaimer
01/14/2007 Rev. 1.00
www.SiliconStandard.com
3
GD32 MCU
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