Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd |
| 包装说明 | SOJ, SOJ20/26,.34 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 100 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J20 |
| JESD-609代码 | e0 |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 4 |
| 端子数量 | 20 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ20/26,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.06 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| MSM514256B-10JS | MSM514256BL-80ZS | MSM514256B-80RS | MSM514256B-70ZS | MSM514256BL-60ZS | MSM514256BL-10ZS | MSM514256B-70JS | MSM514256B-60RS | MSM514256B-80ZS | MSM514256BL-10RS | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 60ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 60ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PDIP20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | DIP, DIP20,.3 | ZIP, ZIP20,.1 | ZIP, ZIP20,.1 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | ZIP, ZIP20,.1 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| 最长访问时间 | 100 ns | 80 ns | 80 ns | 70 ns | 60 ns | 100 ns | 70 ns | 60 ns | 80 ns | 100 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-J20 | R-PZIP-T20 | R-PDIP-T20 | R-PZIP-T20 | R-PZIP-T20 | R-PZIP-T20 | R-PDSO-J20 | R-PDIP-T20 | R-PZIP-T20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | ZIP | DIP | ZIP | ZIP | ZIP | SOJ | DIP | ZIP | DIP |
| 封装等效代码 | SOJ20/26,.34 | ZIP20,.1 | DIP20,.3 | ZIP20,.1 | ZIP20,.1 | ZIP20,.1 | SOJ20/26,.34 | DIP20,.3 | ZIP20,.1 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 最大待机电流 | 0.001 A | 0.0002 A | 0.001 A | 0.001 A | 0.0002 A | 0.0002 A | 0.001 A | 0.001 A | 0.001 A | 0.0002 A |
| 最大压摆率 | 0.06 mA | 0.07 mA | 0.07 mA | 0.08 mA | 0.09 mA | 0.06 mA | 0.08 mA | 0.09 mA | 0.07 mA | 0.06 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL |
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