AHCT/VHCT SERIES, QUAD 2-INPUT AND GATE, PDSO14, PLASTIC, TVSOP-14
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP14,.25 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | AHCT/VHCT |
| JESD-30 代码 | R-PDSO-G14 |
| 长度 | 4.4 mm |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 宽度 | 3.6 mm |
| SN74AHCT08DGV | 5962-9682101VCA | SN54AHCT08FK | SN74AHCT08DBLE | SN54AHCT08FKR | SN54AHCT08WR | |
|---|---|---|---|---|---|---|
| 描述 | AHCT/VHCT SERIES, QUAD 2-INPUT AND GATE, PDSO14, PLASTIC, TVSOP-14 | Quadruple 2-Input Positive-AND Gates 14-CDIP -55 to 125 | AHCT/VHCT SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, CC-20 | Quadruple 2-Input Positive-AND Gates 14-SSOP -40 to 85 | AHCT/VHCT SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, CC-20 | AHCT/VHCT SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, FP-14 |
| 零件包装代码 | SOIC | DIP | QFN | SSOP | QFN | DFP |
| 包装说明 | TSSOP, TSSOP14,.25 | DIP, DIP14,.3 | QCCN, | SSOP, SSOP14,.3 | QCCN, | DFP, |
| 针数 | 14 | 14 | 20 | 14 | 20 | 14 |
| Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | unknown | unknown |
| 系列 | AHCT/VHCT | AHCT/VHCT/VT | AHCT/VHCT | AHCT/VHCT/VT | AHCT/VHCT | AHCT/VHCT |
| JESD-30 代码 | R-PDSO-G14 | R-GDIP-T14 | S-CQCC-N20 | R-PDSO-G14 | S-CQCC-N20 | R-GDFP-F14 |
| 长度 | 4.4 mm | 19.94 mm | 8.89 mm | 6.2 mm | 8.89 mm | 9.21 mm |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 20 | 14 | 20 | 14 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | TSSOP | DIP | QCCN | SSOP | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | FLATPACK |
| 传播延迟（tpd） | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 5.08 mm | 2.03 mm | 2 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | FLAT |
| 端子节距 | 0.4 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 3.6 mm | 7.62 mm | 8.89 mm | 5.3 mm | 8.89 mm | 6.29 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
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