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CPC7582MBTR

产品描述Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16
产品类别无线/射频/通信    电信电路   
文件大小487KB,共19页
制造商IXYS
标准
下载文档 详细参数 选型对比 全文预览

CPC7582MBTR概述

Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16

CPC7582MBTR规格参数

参数名称属性值
是否Rohs认证符合
厂商名称IXYS
包装说明ROHS COMPLIANT, DFN-16
Reach Compliance Codecompliant
JESD-30 代码R-PDSO-G16
JESD-609代码e3
长度7 mm
湿度敏感等级3
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HVSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1 mm
标称供电电压5 V
表面贴装YES
电信集成电路类型TELECOM CIRCUIT
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
处于峰值回流温度下的最长时间35
宽度6 mm

CPC7582MBTR相似产品对比

CPC7582MBTR CPC7582BATR CPC7582BBTR CPC7582BCTR CPC7582MATR CPC7582MA CPC7582MB CPC7582MCTR CPC7582MC
描述 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, SOIC-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, SOIC-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, SOIC-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16 Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, DFN-16
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
包装说明 ROHS COMPLIANT, DFN-16 ROHS COMPLIANT, SOIC-16 ROHS COMPLIANT, SOIC-16 ROHS COMPLIANT, SOIC-16 ROHS COMPLIANT, DFN-16 ROHS COMPLIANT, DFN-16 ROHS COMPLIANT, DFN-16 ROHS COMPLIANT, DFN-16 ROHS COMPLIANT, DFN-16
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3 e3
长度 7 mm 10.211 mm 10.211 mm 10.211 mm 7 mm 7 mm 7 mm 7 mm 7 mm
湿度敏感等级 3 1 1 1 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端子数量 16 16 16 16 16 16 16 16 16
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSSOP SOP SOP SOP HVSSOP HVSSOP HVSSOP HVSSOP HVSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 2.54 mm 2.54 mm 2.54 mm 1 mm 1 mm 1 mm 1 mm 1 mm
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
电信集成电路类型 TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) MATTE TIN MATTE TIN Matte Tin (Sn) Matte Tin (Sn) MATTE TIN MATTE TIN Matte Tin (Sn) MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 35 35 35 35 35 35 35 35 35
宽度 6 mm 7.493 mm 7.493 mm 7.493 mm 6 mm 6 mm 6 mm 6 mm 6 mm
厂商名称 IXYS - - IXYS IXYS IXYS IXYS IXYS IXYS

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