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MJD13003-I

产品描述TRANSISTOR 1.5 A, 400 V, NPN, Si, POWER TRANSISTOR, CASE 369-07, 3 PIN, BIP General Purpose Power
产品类别分立半导体    晶体管   
文件大小133KB,共12页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MJD13003-I概述

TRANSISTOR 1.5 A, 400 V, NPN, Si, POWER TRANSISTOR, CASE 369-07, 3 PIN, BIP General Purpose Power

MJD13003-I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称ON Semiconductor(安森美)
包装说明IN-LINE, R-PSIP-T3
针数3
制造商包装代码CASE 369-07
Reach Compliance Codecompliant
ECCN代码EAR99
外壳连接COLLECTOR
最大集电极电流 (IC)1.5 A
集电极-发射极最大电压400 V
配置SINGLE
最小直流电流增益 (hFE)5
JESD-30 代码R-PSIP-T3
JESD-609代码e0
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)225
极性/信道类型NPN
认证状态Not Qualified
表面贴装NO
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON
标称过渡频率 (fT)10 MHz

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High Voltage SWITCHMODET Series
DPAK For Surface Mount Applications
This device is designed for high–voltage, high–speed power
switching inductive circuits where fall time is critical. It is particularly
suited for 115 and 220 V SWITCHMODE applications such as
switching regulators, inverters, motor controls, solenoid/relay drivers
and deflection circuits.
MJD13003
NPN SILICON
POWER TRANSISTOR
1.5 AMPERES
400 VOLTS
15 WATTS
Lead Formed for Surface Mount Applications in Plastic Sleeves (No
Suffix)
Straight Lead Version in Plastic Sleeves (“–1” Suffix)
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
Reverse Biased SOA with Inductive Loads @ T
C
= 100_C
Inductive Switching Matrix 0.5 to 1.5 Amp, 25 and 100_C . . .
t
c
@ 1.0 A,
100_C is 290 ns (Typ)
700 V Blocking Capability
Switching and SOA Applications Information
Electrically Similar to the Popular MJE13003
CASE 369A–13
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MAXIMUM RATINGS
Rating
Symbol
Value
400
700
9
Unit
Vdc
Vdc
Vdc
Adc
Collector–Emitter Voltage
Collector–Emitter Voltage
Emitter Base Voltage
V
CEO(sus)
V
CEV
V
EBO
I
C
I
B
I
E
I
CM
I
BM
I
EM
P
D
P
D
Collector Current — Continuous
— Peak (1)
Base Current — Continuous
— Peak (1)
1.5
3
0.75
1.5
2.25
4.5
Adc
Emitter Current — Continuous
— Peak (1)
Adc
Total Power Dissipation @ T
A
= 25_C (2)
Derate above 25_C
Total Power Dissipation @ T
C
= 25_C
Derate above 25_C
Operating and Storage Junction
Temperature Range
1.56
0.0125
15
0.12
Watts
W/_C
Watts
W/_C
_C
T
J
, T
stg
–65 to +150
CASE 369–07
MINIMUM PAD SIZES
RECOMMENDED FOR
SURFACE MOUNTED
APPLICATIONS
0.190
4.826
Characteristic
Symbol
R
θJC
R
θJA
T
L
Max
Unit
Thermal Resistance, Junction to Case
8.33
80
_C/W
_C/W
_C
Thermal Resistance, Junction to Ambient (2)
Maximum Lead Temperature for
Soldering Purposes
260
(1) Pulse Test: Pulse Width = 5 ms, Duty Cycle
v
10%.
(2) When surface mounted on minimum pad sizes recommended.
SWITCHMODE are trademarks of ON Semiconductor, Inc.
©
Semiconductor Components Industries, LLC, 2001
1
January, 2001 – Rev. 1
0.243
6.172
THERMAL CHARACTERISTICS
0.063
1.6
inches
mm
PublicMJD13003/D
0.118
3.0
0.07
1.8
0.165
4.191

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