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LH7A404-N0F-000

产品描述IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,BGA,324PIN
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共78页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

LH7A404-N0F-000概述

IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,BGA,324PIN

LH7A404-N0F-000规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
包装说明FBGA, BGA324,20X20,32
Reach Compliance Codeunknown
JESD-30 代码S-XBGA-B324
端子数量324
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料CERAMIC
封装代码FBGA
封装等效代码BGA324,20X20,32
封装形状SQUARE
封装形式GRID ARRAY, FINE PITCH
电源1.8,3.3 V
认证状态Not Qualified
表面贴装YES
温度等级INDUSTRIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM

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LH7A404
Data Sheet
FEATURES
• 32-bit ARM9TDMI™ RISC Core
– 16KB Cache: 8KB Instruction and 8KB Data Cache
– MMU (Windows CE™ Enabled)
– Up to 266 MHz; See Table 1 for speed/temp options
• 80KB On-Chip Static RAM
• Vectored Interrupt Controller
• External Bus Interface
– Up to 133 MHz; See Table 1 for bus speed options
– Asynchronous and Synchronous interface RAM,
Flash, PC Card and CompactFlash
• Clock and Power Management
– 32.768 kHz and 14.7456 MHz Oscillators
– Programmable PLL
• Programmable LCD Controller
– Up to 1,024 × 768 Resolution
– Supports STN, Color STN, AD-TFT, HR-TFT, TFT
– Up to 64 K-Colors and 15 Gray Shades
• 9 Channel, 10-bit A/D Converter
– Touch Screen Controller
– Brownout Detector
• DMA (12 Channels)
– External DMA Channels
– AC97
– MMC
– USB
• USB 2.0 Full Speed Host (two downstream ports)
• USB 2.0 Full Speed Device
• Synchronous Serial Port (SSP)
– Motorola SPI™, Texas Instruments SSI, National
Semiconductor MICROWIRE™
• On-board Boot ROM
– Variety of Boot Modes: external ROM, NAND
Flash, Serial EEPROM, or XMODEM
• PS/2 Keyboard/Mouse Interface (KMI)
32-Bit System-on-Chip
• Three Programmable Timers
• Three UARTs, one with Classic IrDA (115 kbit/s)
• Smart Card Interface (ISO7816)
• Four Pulse Width Modulators (PWMs)
• MultiMediaCard Interface with Secure Digital
(MMC 2.11/SD 1.0)
• AC97 Codec Interface
• Smart Battery Monitor Interface
• Real Time Clock (RTC)
• Up to 64 General Purpose I/O Channels
• Watchdog Timer
• JTAG Debug Interface and Boundary Scan
• Operating Voltage
– 1.8 V (200 MHz), 2.1 V (266 MHz) Core
– 3.3 V Input/Output (Except XTALIN is 1.8 V)
• 5 V Tolerant Digital Inputs (excludes oscillator pins)
– Oscillator pins T19, T20, Y18, Y19: 1.8 V ± 10%
• Operating Temperature:
-40°C to +85°C
• 324-Ball CABGA Package
DESCRIPTION
The advent of 3G technology opens up a wide range
of multimedia applications in mobile information appli-
ances. The LH7A404 is designed from the ground up
with a 32-bit ARM922 Core to provide high processing
performance, low power consumption, and a high level
of integration. Features include 80KB on-chip SRAM,
fully static design, power management unit, low voltage
(1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE:
Devices containing lead-free solder formulations have differ-
ent reflow temperatures than leaded-solder formulations.
When using both solder formulations on the same PC board,
designers should consider the effect of different reflow tem-
peratures on the overall PCB assembly process. (Refer to
www.sharpmcu.com for an application note on recomended
soldering practices).
Table 1. LH7A404 Versions
PART NUMBER
1
LH7A404-N0E-092-xx
LH7A404-N0F-092-xx
2
LH7A404-N0E-000-xx
LH7A404-N0F-000-xx
2
CORE CLOCK BUS CLOCK
266 MHz
200 MHz
133 MHz
100 MHz
LOW POWER CURRENT BY MODE
Run = 228 mA (Typ.); Halt = 60 mA (Typ.);
Standby = 200
μA
(Typ.)
Run = 147 mA (Typ.); Halt = 41 mA (Typ.);
Standby = 70
μA
(Typ.)
TEMP. RANGE
-40°C to +85°C
-40°C to +85°C
NOTES:
1. Where ‘xx’ is a two digit revision number, e.g. B2; refer to
www.sharpmcu.com for a list of all the active revisions
2. Lead-free part.
SPI is a trademark of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corporation.
ARM922T and ARM9TDMI are trademarks of Advanced RISC Machines Ltd.
Windows CE is a trademark of Microsoft Corporation.
Data Sheet
Version 1.5
1

LH7A404-N0F-000相似产品对比

LH7A404-N0F-000
描述 IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,BGA,324PIN
是否Rohs认证 符合
厂商名称 NXP(恩智浦)
包装说明 FBGA, BGA324,20X20,32
Reach Compliance Code unknown
JESD-30 代码 S-XBGA-B324
端子数量 324
最高工作温度 85 °C
最低工作温度 -40 °C
封装主体材料 CERAMIC
封装代码 FBGA
封装等效代码 BGA324,20X20,32
封装形状 SQUARE
封装形式 GRID ARRAY, FINE PITCH
电源 1.8,3.3 V
认证状态 Not Qualified
表面贴装 YES
温度等级 INDUSTRIAL
端子形式 BALL
端子节距 0.8 mm
端子位置 BOTTOM

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