Datasheet> 器件分类 > 分立半导体> 二极管> HSM105

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HSM105: 产品描述1 A, 800 V, SILICON, SIGNAL DIODE; 产品类别分立半导体二极管; 文件大小210KB，共5页; 制造商Rectron Semiconductor; 官网地址http://www.rectron.com/; 标准

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HSM105概述

1 A, 800 V, SILICON, SIGNAL DIODE

HSM105规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Rectron Semiconductor
零件包装代码	MELF
包装说明	ROHS COMPLIANT, PLASTIC, MELF-2
针数	2
Reach Compliance Code	_compli
ECCN代码	EAR99
其他特性	METALLURGICALLY BONDED
外壳连接	ISOLATED
配置	SINGLE
二极管元件材料	SILICON
二极管类型	RECTIFIER DIODE
最大正向电压 (VF)	1.3 V
JESD-30 代码	O-PELF-R2
JESD-609代码	e3
最大非重复峰值正向电流	30 A
元件数量	1
端子数量	2
最高工作温度	175 °C
最大输出电流	1 A
封装主体材料	PLASTIC/EPOXY
封装形状	ROUND
封装形式	LONG FORM
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
最大重复峰值反向电压	400 V
最大反向恢复时间	0.05 µs
表面贴装	YES
端子面层	Matte Tin (Sn)
端子形式	WRAP AROUND
端子位置	END
处于峰值回流温度下的最长时间	10

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VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere

FEATURES

Glass passivated device

Ideal for surface mounted applications

Low leakage current

Metallurgically bonded construction

Mounting position: Any

Weight: 0.015 gram

SURFACE MOUNT GLASS PASSIVATED

HIGH EFFICIENCY SILICON RECTIFIER

HSM101

THRU

HSM108

MECHANICAL DATA

DISCONTINUED-

* Epoxy : Device has UL flammability classification 94V-0

.205 ( 5.2 )

.190 ( 4.8 )

SOLDERABLE

ENDS

MELF

"This series is replaced by the HFM10X series that meets to the same

fit and function parameters and share the same solder pad layout.

The HFM10X series is preferred for error-free vacuum pick-up and

PCB assembly.＂

.024 ( 0.6 )

.016 ( 0.4 )

.106 ( 2.7 )

.095 ( 2.4 )

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25

C ambient temperature unless otherwise specified.

Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Dimensions in inches and (millimeters)

MAXIMUM RATINGS

(@ T

=25

C unless otherwise noted)

RATINGS

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

Maximum DC Blocking Voltage

Maximum Average Forward Rectified Current

at T

= 50

Peak Forward Surge Current 8.3 ms single half sine-wave

superimposed on rated load (JEDEC method)

Typical Junction Capacitance (Note 2)

Operating Temperature Range

Storage Temperature Range

SYMBOL HSM101 HSM102 HSM103 HSM104

RRM

RMS

FSM

STG

150

-55 to + 150

100

200

140

200

300

210

300

1.0

HSM105

400

280

400

HSM106

600

420

600

HSM107

800

490

800

HSM108 UNITS

1000

700

1000

Volts

Amps

ELECTRICAL CHARACTERISTICS

(@T

=25

C unless otherwise noted)

CHARACTERISTICS

Maximum Instantaneous Forward Voltage at 1.0A DC

Maximum Full Load Reverse Current, Full

cycle Average T

=55

Maximum Average Reverse Current

at Rated DC Blocking Voltage

= 25

= 125 C

trr

SYMBOL HSM101 HSM102 HSM103 HSM104

1.0

1.3

HSM105

HSM106

HSM107

1.7

HSM108 UNITS

Volts

100

Maximum Reverse Recovery Time (Note 4)

nSec

2007-5

NOTES : 1. Measured at 1 MHz and applied reverse voltage of 4.0 volts.

2. “Fully ROHS compliant”, “100% Sn plating (Pb-free)”.

3. Test Conditions: I

= 0.5A, I

= -1.0A, I

= -0.25A.

HSM105相似产品对比

	HSM105	HSM101	HSM103	HSM104	HSM107	HSM102	HSM108	HSM106
描述	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE	1 A, 1000 V, SILICON, SIGNAL DIODE	1 A, 800 V, SILICON, SIGNAL DIODE
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor	Rectron Semiconductor
零件包装代码	MELF	MELF	MELF	MELF	MELF	MELF	MELF	MELF
包装说明	ROHS COMPLIANT, PLASTIC, MELF-2	O-PELF-R2	ROHS COMPLIANT, PLASTIC, MELF-2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2
针数	2	2	2	2	2	2	2	2
Reach Compliance Code	_compli	_compli	_compli	_compli	_compli	_compli	_compli	_compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
其他特性	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED	METALLURGICALLY BONDED
外壳连接	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED
配置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
二极管元件材料	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
二极管类型	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
最大正向电压 (VF)	1.3 V	1 V	1 V	1.3 V	1.7 V	1 V	1.7 V	1.5 V
JESD-30 代码	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2	O-PELF-R2
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3
最大非重复峰值正向电流	30 A	30 A	30 A	30 A	30 A	30 A	30 A	30 A
元件数量	1	1	1	1	1	1	1	1
端子数量	2	2	2	2	2	2	2	2
最高工作温度	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C
最大输出电流	1 A	1 A	1 A	1 A	1 A	1 A	1 A	1 A
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装形状	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND
封装形式	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大重复峰值反向电压	400 V	50 V	200 V	300 V	800 V	100 V	1000 V	600 V
最大反向恢复时间	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.075 µs	0.05 µs	0.075 µs	0.075 µs
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
端子形式	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND
端子位置	END	END	END	END	END	END	END	END
处于峰值回流温度下的最长时间	10	10	10	10	10	10	10	10

HSM105

HSM105概述

HSM105规格参数

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