电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

D3899924MF35PE

产品描述MIL Series Connector, 66 Contact(s), Aluminum Alloy, Male, Crimp Terminal, Receptacle,
产品类别连接器    连接器   
文件大小707KB,共13页
制造商Hypertronics Corporation
下载文档 详细参数 全文预览

D3899924MF35PE概述

MIL Series Connector, 66 Contact(s), Aluminum Alloy, Male, Crimp Terminal, Receptacle,

D3899924MF35PE规格参数

参数名称属性值
厂商名称Hypertronics Corporation
Reach Compliance Codeunknown
其他特性STANDARD: MIL-DTL-38999, EMI SHIELDED, POLARIZED
后壳类型SOLID
主体/外壳类型RECEPTACLE
连接器类型MIL SERIES CONNECTOR
联系完成配合GOLD OVER NICKEL
联系完成终止GOLD OVER NICKEL
触点性别MALE
耦合类型THREADED
DIN 符合性NO
空壳NO
环境特性FLUID/IMMERSION RESISTANT
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性YES
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装类型CABLE AND PANEL
选件GENERAL PURPOSE
外壳面层NICKEL PLATED
外壳材料ALUMINUM ALLOY
外壳尺寸F
端接类型CRIMP
触点总数66

文档预览

下载PDF文档
HyperRel Series
HyperRel Series
Ruggedized Connectors Intermateable
with MIL-DTL-38999 Series III
Available with metal (HRM) and composite (HRC) shells
Ruggedized socket interconnects
High shock and vibration resistance
Metal and composite shell styles
Hypertac
®
style 39029 contacts
Intermateable with industry standard Mil 38999
Series III connectors
• Cable-to-cable and panel mount styles available
• Available with high temperature hyperboloid
contact technology
HRC (HyperRel Composite): Highlights
The HyperRel HRC is a high performance composite
connector intermateable with MIL-DTL-38999 Series III
connectors. The combination of the legendary Hypertac
contact with the superior design of the composite
shell/insert, along with the respective strain reliefs, favorably
influence intra-system life-cycle performance and costs.
Shells:
The total performance of the HRC connector is
matched by the individual components within the system.
For example, the use of composite materials increases
the durability of the connector housing and coupling
mechanism to 1500 cycles.
Specifications:
EMI shielding effectiveness
Meets and exceeds the requirements of MIL-DTL-38999,
paragraph 3.3.1
Fluid immersion
Meets and exceeds the requirements of MIL-DTL-38999,
paragraph 3.33
Temperature
The metal surface will not delaminate from the composite
material even after extreme temperature excursions.
The HRC meets all requirements of MIL-DTL-38999,
paragraph 3.8
Magnetic permeability
The magnetic permeability of the fully assembled HRC
connector is less than 2.0 µ, meeting all the requirements
of MIL-DTL-38999, paragraph 3.3.4
Materials
All the materials used in the shell and inserts in the HRC
are in accordance with MIL-DTL-38999, paragraph 3.3.
The contacts are in accordance with MIL-C-39029,
paragraph 3.3
Finish
Shells: Meet the requirements of MIL-DTL-38999
Contacts: Meets the requirements of MIL-C-39029
Insulation resistance
Meets all the requirements of MIL-DTL-38999,
paragraph 3.13
Dielectric withstanding voltage
Meets all the requirements of MIL-DTL-38999,
paragraph 3.14
Contacts:
Up to 80% less mating force
50% reduction in resistance
300% increase in mating cycles
Vibration/shock proven at 2 nano seconds
Five times more contact elements than the
MIL-C-39029 (e.g. Size number 22)
• Hypertac contact life expectancy (fretting) is
100 times longer than the MIL-C-39029 contact
The HRC eliminates the largest contributing factor in
advanced systems malfunction: corrosion – the main cause
of mechanical, electrical, and electromagnetic connector
degradation. Electromotive force differentials between many
dissimilar metals found in connectors and accessories
produce galvanic action. The HRC eliminates these dissimilar
metals resulting in an interconnect system that withstands
over 2000 hours of salt spray.
Dimensions are in inches [mm]
www.hypertronics.com
2 / 37
帮忙看一下这款FPGA开发板怎么样?
我对FPGA不太了解,前些天看到mouser上新出的的这款板子,不到800块钱挺便宜的,如果作为新手入门怎么样? 玩这种板子需要官方提供例程吗? FPGA常说的IP和例程是一回事儿吗? 相关资料应该到 ......
littleshrimp FPGA/CPLD
在Vmware虚拟机上启动VxWorks,显示错误 【tBoot】 sysNvRamGet: Open failed,请问是什么原因?内有详细描述
我在Vmware虚拟机上启动VxWorks后,出错时的界面信息如下: 0x2dd0d4(tBoot) sysNvRamGet: Open failed. Press any key to stop auto-boot... 0 auto-booting... boot device :ln ......
chna0410 实时操作系统RTOS
0.65MM间距的BGA间距需要用的盲埋孔吗?
45117 0.65MM间距的BGA间距需要用的盲埋孔吗?...
honey2012 PCB设计
FLUKE招聘啦!
464844 岗位:市场部实习生 我们在寻找这样的小伙伴:对未知的市场营销充满探索,对新鲜事物充永远好奇与钻研,愿意钻研与投入自己热爱的事物。 【工作职责】 1. 管理 ......
eric_wang 求职招聘
为什么用multisim 传递函数的时候transfer function 总是0 啊
如图所示,想求 放大电路放大倍数,怎么老是0 啊...
564201727 模拟电子
FPGA的扩展
本人菜鸟, 1。请问FPGA开发板(CYCLONE)如何与FM1808连接?中间是否需要别的器件,如不需要,引脚如何对应? ...
aleksoft 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 965  1034  1490  615  1541  8  57  33  30  54 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved