TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail:
tstsales@mail.taisaw.com
Web:
www.taisaw.com
SMD 5.0x3.2 14.7456MHz TCXO
MODEL NO.: TX0184A
REV. NO.: 2
Features:
Miniature SMD Package
Good Frequency Stability
Good Phase Noise Response
Description and Applications:
Surface mount 5.0mmx3.2mmm TCXO for use in wireless communication system
Electrical Specifications:
TX0184A
Nominal Frequency, Fo
Storage Temperature Range
Operating Temperature Range
Power Supply Voltage, Vcc
Output Voltage with Load 10pF//10KΩ, Vout
Power Supply Current, Icc
Frequency Tolerance
Frequency Stability
a. Vs. Temperature (-40~85
°
C)
b. Vs. Supply Voltage varied 3V+/-5%
Start Up Time (90% of final RF level in Vp-p)
Specifications
14.745600 MHz
-40
°
C to +85
°
C
-40
°
C to +85
°
C
3.3 V
0.8 Vp-p min
2.0 mA max
+/- 2.0 ppm max @ 25
°
C +/- 3
°
C
+/- 3.0 ppm
+/- 0.2 ppm
2.0 msec max.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
2
Mechanical Dimensions (mm):
Recommended Circuit
Marking:
Line 1: Customer Frequency (14.745)
Line 2: (pin #1 dot) + TST Logo + Product Code + Date Code+ Traceability Code(XX=CB)
14.745
T
○
xDXX
Product Code Table
Ye a r
Pro d u ct Co d e
Date Code Table
WK01
A
WK14
N
WK27
a
WK40
n
WK02
B
WK15
O
WK28
b
WK41
o
WK03
C
WK16
P
WK29
c
WK42
p
2008
2012
2009
2013
2010
2014
2011
2015
x
X
x
X
WK04
D
WK17
Q
WK30
d
WK43
q
WK05
E
WK18
R
WK31
e
WK44
r
WK06
F
WK19
S
WK32
f
WK45
s
WK07
G
WK20
T
WK33
g
WK46
t
WK08
H
WK21
U
WK34
h
WK47
u
WK09
I
WK22
V
WK35
i
WK48
v
WK10
J
WK23
W
WK36
j
WK49
w
WK11
K
WK24
X
WK37
k
WK50
x
WK12
L
WK25
Y
WK38
l
WK51
y
WK13
M
WK26
Z
WK39
m
WK52
z
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
3
Reel Dimensions (mm):
Tape Dimensions (mm):
[NOTE]:
1. Unless otherwise specified tolerance on dimension +/-0.1 mm.
2. Material: conductive polystyrene with color black
3. 10 pitch cumulative tolerance +/-0.2 mm.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
4
Reflow Profile:
300
Reflow Area
250
Temperature (deg C)
200
150
100
50
0
0
Rising Area
Preheat Area
Forced Cooling Area
Max peak temperature: 260 deg C
60
120
180
Time (seconds)
240
300
360
Notes of the Usage:
1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the
solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec.
2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering
terminals, also make some cracks on the soldering termination. Some cracks will cause
open or short circuit and cause of thermal increasing or smoking. Don’t make any excess
mechanical stress to soldering points.
3. In case of giving a heavy shock to the products, it may make an open or short circuit and
cause of thermal increasing and smoking. To avoid heavy shock impact applying to
products is strictly required.
Notes of the Storage:
1. To keep products under the condition at the room temperature (-5~35 deg C) with normal
humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of
characteristics and a short circuit.
2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas
will make a cause of the open or short circuit. Keep it in the clean place where is not in
dusty and no corrosive gas.
3. Use the unti-static material to the storage package.
4. Don’t put any excess weight to the TCXO in the storage process.
5. Don’t move the product from the cold place to the hot place in the short time, otherwise it
may make some dew-drop, then a short circuit may happen in case.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
5
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