电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MXHSMBJ5952DE3TR

产品描述Zener Diode, 130V V(Z), 1%, 1.56W, Silicon, Unidirectional, DO-214AA, ROHS COMPLIANT, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小125KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

MXHSMBJ5952DE3TR概述

Zener Diode, 130V V(Z), 1%, 1.56W, Silicon, Unidirectional, DO-214AA, ROHS COMPLIANT, PLASTIC PACKAGE-2

MXHSMBJ5952DE3TR规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-214AA
包装说明ROHS COMPLIANT, PLASTIC PACKAGE-2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-214AA
JESD-30 代码R-PDSO-C2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.56 W
认证状态Not Qualified
标称参考电压130 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差1%
工作测试电流2.9 mA

文档预览

下载PDF文档
HSMBJ5913 thru HSMBJ5956, e3
SILICON 3.0 Watt ZENER DIODE
SCOTTSDALE DIVISION
DESCRIPTION
The HSMBJ5913-5956B series of surface mount 3.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 200 volts with different tolerances
as identified by suffix letter on the part number. It is equivalent to the JEDEC
registered 1N5913 thru 1N5956B with identical electrical characteristics
except it is rated at 3.0 W instead of 1.5 W with the lower thermal resistance
features of this surface mount packaging. These plastic encapsulated Zeners
have a moisture classification of Level 1 with no dry pack required and are
also available in military equivalent screening levels by adding a prefix
identifier as further described in the Features section. Microsemi also offers
numerous other Zener products to meet higher and lower power applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
PACKAGE
WWW .
Microsemi
.C
OM
DO-214AA
(see package notes)
FEATURES
Surface mount equivalent to 1N5913 to
1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
RoHS Compliant devices available by adding
“e3’ suffix
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Nonsensitive to ESD per MIL-STD-750 Method
1020
High specified maximum current (I
ZM
) when
adequately heat sinking
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
MAXIMUM RATINGS
Power dissipation at 25
º
C: 3.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 15
º
C/W junction to lead,
º
or 80 C/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
Steady-State Power: 3 watts at T
L
< 105
o
C, or
1.56 watts at T
A
= 25
º
C when mounted on FR4
PC board with recommended footprint (also see
Figure1)
Forward voltage @200 mA: 1.2 volts
(maximum)
Solder Temperatures: 260 C for 10 s
(maximum)
º
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: C-bend (modified J-bend) leads, Tin-
Lead or RoHS Compliant annealed matte-Tin
plating solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Includes part number without prefix
(e.g. 5913B, 5926C, 5951D, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
HSMBJ5913-595
6B,e3
Copyright
©
2006
3-12-2006 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
DSP生成bin文件方法
449464 里面"${ProjName}.out"改为"${ProjName}.bin"从新编译即可。 ...
火辣西米秀 DSP 与 ARM 处理器
帮忙解是一个问题!!!!
这是我的程序编译结束后的部分提示信息!!!我想知道两次提示存储器占用信息都是表示什么意思,两次有什么区别。谢谢!!!!! Copyright 1996-2004 IAR Systems. All rights reserved. Wa ......
ruohanlee 微控制器 MCU
利用FPGA 对外部芯片进行直通连线遇到的问题
背景介绍: 硬件架构FPGA+DSP , DSP的管脚信号wen,rdn,cs 通过FPGA IO 连接到外部RAM 中,这样做的目的考虑到FPGA可以访问DSP,或者设计为DSP也可以访问外部RAM,硬件设计兼容,不用 ......
eeleader FPGA/CPLD
我也来晒晒【POS机套件】
今天收到快递来的【POS机套件】,我也来晒晒,开始研究研究,还望有高手带领DIY最好: 110973 110974 110975 110972...
zndz410 模拟与混合信号
设备接地电阻值测量过程
征能ES3010E接地电阻土壤电阻率测试仪(简易型)可以使用2、3、4线法测量接地电阻、土壤电阻率、接地电压测量等功能。接地电阻量程可达:0.00Ω~30.00KΩ,土壤电阻率量程可达:0.00ΩM~9999K ......
gzznele 工业自动化与控制
2.0后的sdk怎样在vc中添加brew工程
2.0后的sdk怎样在vc中添加brew工程?请高手指点 谢谢...
kangling1983 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2740  1356  131  1489  1924  56  28  3  30  39 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved