LED Light Bars
Technical Data
HLCP-A100, -B100, -C100,
-D100, -E100, -F100, -G100,
-H100
HLMP-2300, -2350, -2400,
-2450, -2500, -2550, -2600,
-2620, -2635, -2655, -2670,
-2685, -2700, -2720, -2735,
-2755, -2770, -2785, -2800,
-2820, -2835, -2855, -2870,
-2885, -2950, -2965
Features
• Large Bright, Uniform Light
Emitting Areas
• Choice of Colors
• Categorized for Light Output
• Yellow and Green
Categorized for Dominant
Wavelength
• Excellent ON-OFF Contrast
• X-Y Stackable
• Flush Mountable
• Can be Used with Panel and
Legend Mounts
• Light Emitting Surface
Suitable for Legend
Attachment per Application
Note 1012
• HLCP-X100 Series Designed
for Low Current Operation
• Bicolor Devices Available
Description
The HLCP-X100 and HLMP-2XXX
series light bars are rectangular
light sources designed for a
variety of applications where a
large bright source of light is
required. These light bars are
configured in single-in-line and
dual-in-line packages that contain
either single or segmented light
emitting areas. The AlGaAs Red
HLCP-X100 series LEDs use
double heterojunction AlGaAs on
a GaAs substrate. The HER
HLMP-2300/2600 and Yellow
HLMP-2400/2700 series LEDs
have their p-n junctions diffused
into a GaAsP epitaxial layer on a
GaP substrate. The Green HLMP-
2500/2800 series LEDs use a
liquid phase GaP epitaxial layer
on a GaP substrate. The bicolor
HLMP-2900 series use a
combination of HER/Yellow or
HER/Green LEDs.
Applications
• Business Machine
Message Annunciators
• Telecommunications
Indicators
• Front Panel Process Status
Indicators
• PC Board Identifiers
• Bar Graphs
5
Absolute Maximum Ratings
Parameter
AlGaAs Red
HLCP-X100
Series
37 mW
[1]
45 mA
[4]
15 mA
15 mA
[1]
5V
–20°C to +100°C
[7]
HER
HLMP-2300/
2600/29XX
Series
135 mW
[2]
90 mA
[5]
25 mA
30 mA
[2]
Yellow
HLMP-2400/
2700/2950
Series
85 mW
[3]
60 mA
[5]
20 mA
25 mA
[3]
6 V
[6]
–40°C to +85°C
–40°C to +85°C
260°C for 3 seconds
[8]
–20°C to +85°C
Green
HLMP-2500/
2800/2965
Series
135 mW
[2]
90 mA
[5]
25 mA
30 mA
[2]
Average Power Dissipated per LED Chip
Peak Forward Current per LED Chip
Average Forward Current per LED Chip
DC Forward Current per LED Chip
Reverse Voltage per LED Chip
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature 1.6 mm
(1/16 inch) Below Seating Plane3
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Agilent sales representative.
8. Maximum tolerable component side temperature is 134°C during solder process.
Electrical/Optical Characteristics at T
A
= 25
°
C
AlGaAs Red HLCP-X100 Series
Parameter
Luminous Intensity
per Lighting Emitting
Area
[1]
Peak Wavelength
Dominant Wavelength
[2]
Forward Voltage per LED
Reverse Breakdown Voltage per LED
Thermal Resistance LED Junction-to-Pin
HLCP-
A100/D100/E100
B100/C100/F100/G100
H100
λ
PEAK
λ
d
V
F
V
R
Rθ
J-PIN
5
Symbol
I
V
Min.
3
6
12
Typ.
7.5
15
30
645
637
1.8
15
250
2.2
Max.
Units
mcd
mcd
mcd
nm
nm
V
V
°C/W/
LED
I
F
= 20 mA
I
R
= 100
µA
Test Conditions
I
F
= 3 mA
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