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Datasheet> 器件分类 > 存储> 存储> AM29LV033C90WDE

AM29LV033C90WDE: 产品描述4MX8 FLASH 3V PROM, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63; 产品类别存储存储; 文件大小988KB，共47页; 制造商AMD(超微); 官网地址http://www.amd.com

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AM29LV033C90WDE概述

4MX8 FLASH 3V PROM, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63

AM29LV033C90WDE规格参数

参数名称	属性值
厂商名称	AMD(超微)
零件包装代码	BGA
包装说明	TFBGA,
针数	63
Reach Compliance Code	unknown
最长访问时间	90 ns
其他特性	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
JESD-30 代码	R-PBGA-B63
长度	14 mm
内存密度	33554432 bit
内存集成电路类型	FLASH
内存宽度	8
功能数量	1
端子数量	63
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	4MX8
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
编程电压	3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
宽度	8 mm

AM29LV033C90WDE相似产品对比

	AM29LV033C90WDE	AM29LV033C120EE	AM29LV033C90WDI	AM29LV033C70EI	AM29LV033C120WDE	AM29LV033C70FI	AM29LV033C90FI	AM29LV033C70WDI	AM29LV033C120EI
描述	4MX8 FLASH 3V PROM, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63	4MX8 FLASH 3V PROM, 120ns, PDSO40, TSOP-40	4MX8 FLASH 3V PROM, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63	4MX8 FLASH 3V PROM, 70ns, PDSO40, TSOP-40	4MX8 FLASH 3V PROM, 120ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63	4MX8 FLASH 3V PROM, 70ns, PDSO40, REVERSE, TSOP-40	4MX8 FLASH 3V PROM, 90ns, PDSO40, REVERSE, TSOP-40	4MX8 FLASH 3V PROM, 70ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63	4MX8 FLASH 3V PROM, 120ns, PDSO40, TSOP-40
零件包装代码	BGA	TSOP	BGA	TSOP	BGA	TSOP	TSOP	BGA	TSOP
包装说明	TFBGA,	TSOP-40	TFBGA,	TSOP-40	TFBGA,	TSOP1-R,	REVERSE, TSOP-40	TFBGA,	TSOP-40
针数	63	40	63	40	63	40	40	63	40
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	90 ns	120 ns	90 ns	70 ns	120 ns	70 ns	90 ns	70 ns	120 ns
JESD-30 代码	R-PBGA-B63	R-PDSO-G40	R-PBGA-B63	R-PDSO-G40	R-PBGA-B63	R-PDSO-G40	R-PDSO-G40	R-PBGA-B63	R-PDSO-G40
长度	14 mm	18.4 mm	14 mm	18.4 mm	14 mm	18.4 mm	18.4 mm	14 mm	18.4 mm
内存密度	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1
端子数量	63	40	63	40	63	40	40	63	40
字数	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TSOP1	TFBGA	TSOP1	TFBGA	TSOP1-R	TSOP1-R	TFBGA	TSOP1
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
编程电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	GULL WING	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	GULL WING
端子节距	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm
端子位置	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM	DUAL
宽度	8 mm	10 mm	8 mm	10 mm	8 mm	10 mm	10 mm	8 mm	10 mm
厂商名称	AMD(超微)	-	AMD(超微)	-	-	-	AMD(超微)	AMD(超微)	AMD(超微)
其他特性	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	-	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	-	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	-	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
Base Number Matches	-	1	1	1	1	1	1	1	-

AM29LV033C90WDE

AM29LV033C90WDE概述

AM29LV033C90WDE规格参数

AM29LV033C90WDE相似产品对比

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