LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16, 0.150 INCH, PLASTIC, SOIC-16
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 16 |
Reach Compliance Code | unknown |
其他特性 | ONE FUNCTION WITH TWO BITS |
系列 | LS |
JESD-30 代码 | R-PDSO-G16 |
长度 | 9.9 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 6 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
传播延迟(tpd) | 25 ns |
座面最大高度 | 1.753 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
DM74LS367AM | 54LS367ADMQB | 54LS367AFMQB | 54LS367ALMQB | DM54LS367AW | DM74LS367AN | |
---|---|---|---|---|---|---|
描述 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,LS-TTL,FP,16PIN,CERAMIC | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 |
零件包装代码 | SOIC | DIP | DFP | QLCC | DFP | DIP |
包装说明 | SOP, | DIP, | DFP, | QCCN, | DFP, | DIP, |
针数 | 16 | 16 | 16 | 20 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | ONE FUNCTION WITH TWO BITS | ONE FUNCTION WITH TWO BITS | ONE FUNCTION WITH TWO BITS | ONE FUNCTION WITH TWO BITS | ONE FUNCTION WITH TWO BITS | - |
系列 | LS | LS | LS | LS | LS | - |
JESD-30 代码 | R-PDSO-G16 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 | R-GDFP-F16 | - |
长度 | 9.9 mm | 19.94 mm | 9.6645 mm | 8.89 mm | 9.6645 mm | - |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
位数 | 6 | 6 | 6 | 6 | 6 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | - |
端口数量 | 2 | 2 | 2 | 2 | 2 | - |
端子数量 | 16 | 16 | 16 | 20 | 16 | - |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | - |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - |
封装代码 | SOP | DIP | DFP | QCCN | DFP | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
封装形式 | SMALL OUTLINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | - |
传播延迟(tpd) | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | - |
座面最大高度 | 1.753 mm | 5.08 mm | 2.032 mm | 1.905 mm | 2.032 mm | - |
最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | YES | NO | YES | YES | YES | - |
技术 | TTL | TTL | TTL | TTL | TTL | - |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | - |
端子形式 | GULL WING | THROUGH-HOLE | FLAT | NO LEAD | FLAT | - |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | - |
宽度 | 3.9 mm | 7.62 mm | 6.604 mm | 8.89 mm | 6.604 mm | - |
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