MB05M~MB10M
Miniature Glass Passivated Single-Phase Bridge Rectifier
Major Ratings and Characteristics
I
F(AV)
0.5A
V
RRM
50-1000V
I
FSM
35 A
I
R
5.0 A
V
F
1.0V
T
j
max.
150 °C
Features
Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
High forward surge capability
High temperature soldering
260 /10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
Case: MBM Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(T
A
= 25 °C unless otherwise noted)
MB- Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified current
-on glass-epoxy P.C.B(NOTE 1)
-on aluminum substrate(NOTE 2)
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
Maximum instantaneous forward voltage drop per leg at 0.4A
Maximum DC reverse current at
rated DC blocking voltage per leg
T
A
= 25
T
A
= 125
(NOTE 1)
Thermal resistance per leg
Operating junction and storage temperature range
NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05
NOTE2:On aluminum substrate P.C.B. with an area of 0.8
05M
50
35
50
1M
100
70
100
2M
200
140
200
4M
400
280
400
0.5
0.8
35
1.0
5.0
500
13
85
70
20
6M
600
420
600
8M
800
560
800
10M
1000
700
1000
UNIT
V
V
V
A
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
R
R
JA
JA
JL
A
V
A
pF
/W
Typical junction capacitance per leg at 4.0 V ,1MHz
(NOTE 2)
(NOTE 1)
T
J
, T
STG
(1.3×1.3mm) pads
0.8 (20×20mm) mounted on 0.05×0.05
–55 to +150
(1.3×1.3mm) solder pad
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