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MAX97200

产品描述Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier
文件大小2MB,共13页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX97200概述

Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier

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19-4981; Rev 1; 3/10
TION KIT
EVALUA BLE
AVAILA
Low-Power, Low-Offset, Dual Mode, Class H
DirectDrive Headphone Amplifier
General Description
The MAX97200 is a 45mW Class H headphone amplifier
that runs from a single low 1.8V supply voltage and employs
Maxim’s second-generation DirectDrive
technology.
The MAX97200 features a Dual ModeK internal charge
pump to generate the power rails for the amplifier. The
charge-pump output can be
QPVIN/2
or
QPVIN
depend-
ing on the amplitude of the output signal. When the out-
put voltage is low, the power-supply voltage is
QPVIN/2.
When the output signal demands larger output voltage,
the charge pump switches modes so that a greater
power-supply voltage is realized and more output power
can be delivered to the load.
Second-generation DirectDrive technology improves
power consumption when compared to first-generation
DirectDrive amplifiers. The MAX97200 can be powered
from a regulated 1.8V and have similar power consump-
tion to a traditional DirectDrive amplifier that is powered
from 0.9V.
Maxim’s patented DirectDrive architecture uses an
inverting charge pump to derive a negative voltage
supply. The headphone amplifier is powered between
the positive supply and the generated negative rail.
This scheme allows the audio output signal to be
biased about ground, eliminating the need for large
DC-blocking capacitors between the amplifier output
and the headphone load.
Low-output offset voltage provides very good click-and-
pop performance both into and out of shutdown. High
signal-to-noise ratio maintains system fidelity.
The MAX97200 is available in a tiny, 12-bump wafer
level packaging (WLP 1.27mm x 1.65mm) with a small,
0.4mm lead pitch and specified over the -40NC to +85NC
extended temperature range.
Features
S
Second-Generation DirectDrive Technology
S
Dynamic, Class H, Dual Mode Charge Pump
S
Low Voltage Operation, V
PVIN
= 1.8V
S
Low Quiescent Current, 1.15mA (typ) at V
PVIN
=
1.8V
S
Eliminates Large Output DC-Blocking Capacitors
S
Industry-Leading Click-and-Pop Performance
S
High-Fidelity, SNR 105dB (5.6µV Output Noise)
S
Output Power 34mW into 32I (THD+N 1%)
S
Output Power 45mW into 16I (THD+N 10%)
S
Tiny, 12-Bump, 1.27mm x 1.65mm (0.4mm Lead
Pitch) WLP Package
MAX97200
Ordering Information/
Selector Guide
PART
MAX97200AEWC+
MAX97200BEWC+
GAIN
(dB)
3
0
PIN-
PACKAGE
12 WLP
12 WLP
TOP
MARK
ABF
ABG
Note:
All devices operate over the -40°C to +85°C tempera-
ture range.
+Denotes
a lead(Pb)-free and RoHS-compliant package.
Typical Operating Circuit
MAX97200
LEFT AUDIO
INPUT
Applications
Cellular Phones
Smartphones
MP3 Players
VoIP Phones
DirectDrive is a registered trademark of Maxim Integrated
Products, Inc.
Dual Mode is a trademark of Maxim Integrated Products, Inc.
APPLICATIONS
PROCESSOR
LEFT AUDIO OUTPUT
SHDN
RIGHT AUDIO
INPUT
RIGHT AUDIO
OUTPUT
CHARGE
PUMP
_______________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX97200相似产品对比

MAX97200 MAX97200BEWC+ MAX97200AEWC+
描述 Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier
是否无铅 - 不含铅 不含铅
是否Rohs认证 - 符合 符合
厂商名称 - Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 - BGA BGA
包装说明 - VFBGA, BGA12,3X4,16 VFBGA, BGA12,3X4,16
针数 - 12 12
Reach Compliance Code - compli compli
ECCN代码 - EAR99 EAR99
Factory Lead Time - 6 weeks 12 weeks
商用集成电路类型 - AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 代码 - R-PBGA-B12 R-PBGA-B12
JESD-609代码 - e1 e1
长度 - 1.68 mm 1.68 mm
湿度敏感等级 - 1 1
信道数量 - 2 2
功能数量 - 1 1
端子数量 - 12 12
最高工作温度 - 85 °C 85 °C
最低工作温度 - -40 °C -40 °C
标称输出功率 - 0.045 W 0.045 W
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - VFBGA VFBGA
封装等效代码 - BGA12,3X4,16 BGA12,3X4,16
封装形状 - RECTANGULAR RECTANGULAR
封装形式 - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED
电源 - 1.8 V 1.8 V
认证状态 - Not Qualified Not Qualified
座面最大高度 - 0.69 mm 0.69 mm
最大压摆率 - 1.7 mA 1.7 mA
最大供电电压 (Vsup) - 1.98 V 1.98 V
最小供电电压 (Vsup) - 1.62 V 1.62 V
表面贴装 - YES YES
技术 - BICMOS BICMOS
温度等级 - INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 - BALL BALL
端子节距 - 0.4 mm 0.4 mm
端子位置 - BOTTOM BOTTOM
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED
宽度 - 1.3 mm 1.3 mm

 
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