Line Equalizer, CMOS, PDIP18, PLASTIC, DIP-18
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Qorvo |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 18 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T18 |
JESD-609代码 | e0 |
长度 | 22.86 mm |
负电源额定电压 | -5 V |
功能数量 | 1 |
端子数量 | 18 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
座面最大高度 | 4.32 mm |
最大压摆率 | 4 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
电信集成电路类型 | LINE EQUALIZER |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
ML2008CP | ML2008IP | ML2008CQ | ML2008IQ | ML2009CQ | ML2009CP | ML2009IP | ML2009IQ | |
---|---|---|---|---|---|---|---|---|
描述 | Line Equalizer, CMOS, PDIP18, PLASTIC, DIP-18 | Line Equalizer, CMOS, PDIP18, PLASTIC, DIP-18 | Line Equalizer, CMOS, PQCC20, PLASTIC, LCC-20 | Line Equalizer, CMOS, PQCC20, PLASTIC, LCC-20 | Line Equalizer, CMOS, PQCC20, PLASTIC, LCC-20 | Line Equalizer, CMOS, PDIP18, PLASTIC, DIP-18 | Line Equalizer, CMOS, PDIP18, PLASTIC, DIP-18 | Line Equalizer, CMOS, PQCC20, PLASTIC, LCC-20 |
厂商名称 | Qorvo | Qorvo | Qorvo | Qorvo | Qorvo | Qorvo | Qorvo | Qorvo |
零件包装代码 | DIP | DIP | QLCC | QLCC | QLCC | DIP | DIP | QLCC |
包装说明 | DIP, | DIP, | QCCJ, | QCCJ, | QCCJ, | DIP, | DIP, | QCCJ, |
针数 | 18 | 18 | 20 | 20 | 20 | 18 | 18 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T18 | R-PDIP-T18 | S-PQCC-J20 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T18 | R-PDIP-T18 | S-PQCC-J20 |
长度 | 22.86 mm | 22.86 mm | 8.9662 mm | 8.9662 mm | 8.9662 mm | 22.86 mm | 22.86 mm | 8.9662 mm |
负电源额定电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 20 | 20 | 20 | 18 | 18 | 20 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | QCCJ | QCCJ | QCCJ | DIP | DIP | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.32 mm | 4.32 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.32 mm | 4.32 mm | 4.57 mm |
最大压摆率 | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER | LINE EQUALIZER |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD |
宽度 | 7.62 mm | 7.62 mm | 8.9662 mm | 8.9662 mm | 8.9662 mm | 7.62 mm | 7.62 mm | 8.9662 mm |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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