Modem, 1.2kbps Data, CMOS, PQCC24, PLASTIC, LCC-24
参数名称 | 属性值 |
厂商名称 | CML Microcircuits |
零件包装代码 | LCC |
包装说明 | QCCJ, LDCC24,.44SQ |
针数 | 24 |
Reach Compliance Code | unknown |
数据速率 | 1.2 Mbps |
JESD-30 代码 | S-PQCC-J24 |
长度 | 10.16 mm |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | -30 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC24,.44SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.7 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
电信集成电路类型 | MODEM |
温度等级 | OTHER |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 10.16 mm |
MX419LH | MX419J | MX419P | MX519P | MX519J | |
---|---|---|---|---|---|
描述 | Modem, 1.2kbps Data, CMOS, PQCC24, PLASTIC, LCC-24 | Modem, 1.2kbps Data, CMOS, CDIP22, CERAMIC, DIP-22 | Modem, 1.2kbps Data, CMOS, PDIP22, PLASTIC, DIP-22 | Modem, 1.2kbps Data, CMOS, PDIP16, PLASTIC, DIP-16 | Modem, 1.2kbps Data, CMOS, CDIP16, CERAMIC, DIP-16 |
厂商名称 | CML Microcircuits | CML Microcircuits | CML Microcircuits | CML Microcircuits | CML Microcircuits |
零件包装代码 | LCC | DIP | DIP | DIP | DIP |
包装说明 | QCCJ, LDCC24,.44SQ | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 |
针数 | 24 | 22 | 22 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
数据速率 | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps |
JESD-30 代码 | S-PQCC-J24 | R-GDIP-T22 | R-PDIP-T22 | R-PDIP-T16 | R-GDIP-T16 |
长度 | 10.16 mm | 27.18 mm | 27.685 mm | 19.685 mm | 19.305 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 22 | 22 | 16 | 16 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | QCCJ | DIP | DIP | DIP | DIP |
封装等效代码 | LDCC24,.44SQ | DIP22,.4 | DIP22,.4 | DIP16,.3 | DIP16,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.7 mm | 5.67 mm | 4.95 mm | 5.08 mm | 5.84 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | MODEM | MODEM | MODEM | MODEM | MODEM |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 7.62 mm | 7.62 mm |
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