Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2
参数名称 | 属性值 |
厂商名称 | MACOM |
包装说明 | O-CEMW-N2 |
针数 | 2 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | LOW TURN ON POWER |
应用 | LIMITER |
最小击穿电压 | 200 V |
配置 | SINGLE |
最大二极管电容 | 0.2 pF |
标称二极管电容 | 0.4 pF |
二极管元件材料 | SILICON |
最大二极管正向电阻 | 2 Ω |
二极管电阻测试电流 | 10 mA |
二极管电阻测试频率 | 500 MHz |
二极管类型 | PIN DIODE |
JESD-30 代码 | O-CEMW-N2 |
少数载流子标称寿命 | 0.2 µs |
元件数量 | 1 |
端子数量 | 2 |
最高工作温度 | 125 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | ROUND |
封装形式 | MICROWAVE |
认证状态 | Not Qualified |
反向测试电压 | |
表面贴装 | YES |
技术 | POSITIVE-INTRINSIC-NEGATIVE |
端子形式 | NO LEAD |
端子位置 | END |
MA4L301-30 | MA4L021-30 | MA4L031-30 | MA4L302-30 | MA4L032-30 | |
---|---|---|---|---|---|
描述 | Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2 | Pin Diode, 30V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2 | Pin Diode, 40V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2 | Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2 | Pin Diode, 40V V(BR), Silicon, HERMETIC SEALED, CERAMIC PACKAGE-2 |
厂商名称 | MACOM | MACOM | MACOM | MACOM | MACOM |
包装说明 | O-CEMW-N2 | O-CEMW-N2 | O-CEMW-N2 | O-CEMW-N2 | O-CEMW-N2 |
针数 | 2 | 2 | 2 | 2 | 2 |
Reach Compliance Code | compliant | compli | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | LOW TURN ON POWER | LOW TURN ON POWER | LOW TURN ON POWER | - | LOW TURN ON POWER |
应用 | LIMITER | LIMITER | LIMITER | - | LIMITER |
最小击穿电压 | 200 V | 30 V | 40 V | - | 40 V |
配置 | SINGLE | SINGLE | SINGLE | - | SINGLE |
最大二极管电容 | 0.2 pF | 0.2 pF | 0.2 pF | - | 0.15 pF |
标称二极管电容 | 0.4 pF | 0.4 pF | 0.6 pF | - | 0.35 pF |
二极管元件材料 | SILICON | SILICON | SILICON | - | SILICON |
最大二极管正向电阻 | 2 Ω | 1.5 Ω | 1.5 Ω | - | 2 Ω |
二极管电阻测试电流 | 10 mA | 10 mA | 10 mA | - | 10 mA |
二极管电阻测试频率 | 500 MHz | 500 MHz | 500 MHz | - | 500 MHz |
二极管类型 | PIN DIODE | PIN DIODE | PIN DIODE | - | PIN DIODE |
JESD-30 代码 | O-CEMW-N2 | O-CEMW-N2 | O-CEMW-N2 | - | O-CEMW-N2 |
少数载流子标称寿命 | 0.2 µs | 0.01 µs | 0.015 µs | - | 0.015 µs |
元件数量 | 1 | 1 | 1 | - | 1 |
端子数量 | 2 | 2 | 2 | - | 2 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED |
封装形状 | ROUND | ROUND | ROUND | - | ROUND |
封装形式 | MICROWAVE | MICROWAVE | MICROWAVE | - | MICROWAVE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
表面贴装 | YES | YES | YES | - | YES |
技术 | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | - | POSITIVE-INTRINSIC-NEGATIVE |
端子形式 | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD |
端子位置 | END | END | END | - | END |
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