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PEEL18CV8P-15L

产品描述EE PLD, 15ns, CMOS, PDIP20, 0.300 INCH, LEAD FREE, PLASTIC, DIP-20
产品类别可编程逻辑器件    可编程逻辑   
文件大小636KB,共9页
制造商Integrated Circuit Systems(IDT )
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PEEL18CV8P-15L概述

EE PLD, 15ns, CMOS, PDIP20, 0.300 INCH, LEAD FREE, PLASTIC, DIP-20

PEEL18CV8P-15L规格参数

参数名称属性值
厂商名称Integrated Circuit Systems(IDT )
零件包装代码DIP
包装说明DIP,
针数20
Reach Compliance Codeunknown
其他特性8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
最大时钟频率41.6 MHz
JESD-30 代码R-PDIP-T20
长度26.162 mm
专用输入次数9
I/O 线路数量8
端子数量20
最高工作温度70 °C
最低工作温度
组织9 DEDICATED INPUTS, 8 I/O
输出函数MACROCELL
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
可编程逻辑类型EE PLD
传播延迟15 ns
认证状态Not Qualified
最大供电电压5.25 V
最小供电电压4.75 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm

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PEEL™ 18CV8 -7/-10/-15/-25
CMOS Programmable Electrically Erasable Logic Device
Features
Multiple Speed Power, Temperature Options
- V
CC
= 5 Volts ±10%
- Speeds ranging from 7ns to 25 ns
- Power as low as 37mA at 25MHz
- Commercial and industrial versions available
CMOS Electrically Erasable Technology
- Superior factory testing
- Reprogrammable in plastic package
- Reduces retrofit and development costs
Development / Programmer Support
- Third party software and programmers
- WinPLACE Development Software
- PLD-to-PEEL™ JEDEC file translator
Architectural Flexibility
- Enhanced architecture fits in more logic
- 74 product terms x 36 input AND array
- 10 inputs and 8 I/O pins
- 12 possible macrocell configurations
- Asynchronous clear
- Independent output enables
- 20 Pin DIP/SOIC/TSSOP and PLCC
Application Versatility
- Replaces random logic
- Super sets PLDs (PAL, GAL, EPLD)
- Enhanced Architecture fits more logic than ordinary PLDs
General Description
The PEEL™18CV8 is a Programmable Electrically Erasable
Logic (PEEL™) device providing an attractive alternative to
ordinary PLDs. The PEEL™18CV8 offers the performance, flex-
ibility, ease of design and production practicality needed by logic
designers today.
The PEEL™18CV8 is available in 20-pin DIP, PLCC, SOIC and
TSSOP packages with speeds ranging from 7ns to 25ns with
power consumption as low as 37mA. EE-Reprogrammability
provides the convenience of instant reprogramming for develop-
ment and reusable production inventory minimizing the impact of
programming changes or errors. EE-Reprogrammability also
improves factory testability, thus assuring the highest quality pos-
sible.
The PEEL™18CV8 architecture allows it to replace over 20 stan-
dard 20-pin PLDs (PAL, GAL, EPLD etc.). It also provides addi-
tional architecture features so more logic can be put into every
design. Anachip’s JEDEC file translator instantly converts to the
PEEL™18CV8 existing 20-pin PLDs without the need to rework
the existing design. Development and programming support for the
PEEL™18CV8 is provided by popular third-party program- mers
and development software.
Figure 3 Block Diagram
Figure 2 Pin Configuration
I/CLK
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
DIP
TSSOP
PLCC
SOIC
This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of this product. No rights under any patent
accompany the sale of the product.
Rev. 1.0 Dec 16, 2004
1/9
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