Configuration Memory, 128KX1, CMOS, PQCC20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LSC/CSI |
包装说明 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | unknown |
最大时钟频率 (fCLK) | 10 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J20 |
JESD-609代码 | e0 |
内存密度 | 131072 bit |
内存集成电路类型 | CONFIGURATION MEMORY |
内存宽度 | 1 |
端子数量 | 20 |
字数 | 131072 words |
字数代码 | 128000 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 128KX1 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC20,.4SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.01 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
ATT17128A-M20I | ATT1765A-M20 | ATT17128A-P8I | ATT1765A-P8 | ATT17128A-G8 | |
---|---|---|---|---|---|
描述 | Configuration Memory, 128KX1, CMOS, PQCC20 | Configuration Memory, 64KX1, CMOS, PQCC20 | Configuration Memory, 128KX1, CMOS, PDIP8 | Configuration Memory, 64KX1, CMOS, PDIP8 | Configuration Memory, 128KX1, CMOS, PDSO8 |
包装说明 | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 |
内存密度 | 131072 bit | 65536 bit | 131072 bit | 65536 bit | 131072 bit |
内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
内存宽度 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 8 | 8 | 8 |
字数 | 131072 words | 65536 words | 131072 words | 65536 words | 131072 words |
字数代码 | 128000 | 64000 | 128000 | 64000 | 128000 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
组织 | 128KX1 | 64KX1 | 128KX1 | 64KX1 | 128KX1 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | DIP | DIP | SOP |
封装等效代码 | LDCC20,.4SQ | LDCC20,.4SQ | DIP8,.3 | DIP8,.3 | SOP8,.25 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | e0 | - | e0 | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Base Number Matches | - | 1 | 1 | 1 | - |
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