HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-GDFP-F14 |
| 长度 | 9.21 mm |
| 负载电容（CL） | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 225 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.29 mm |
| SN54HC126WR | SN74HC126DBLE | SN54HC126FK | SN54HC126FKR | SN54HC126J-00 | SN54HC126FK-00 | SN74HC126N-00 | SN74HC126N-10 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14 | Quadruple Bus Buffer Gates With 3-State Outputs 14-SSOP -40 to 85 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14 | HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14 |
| 包装说明 | DFP, | SSOP, SSOP14,.3 | QCCN, LCC20,.35SQ | QCCN, | DIP, | QCCN, | DIP, | DIP, |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 系列 | HC/UH | HC/UH | - | - | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-GDFP-F14 | R-PDSO-G14 | - | - | R-GDIP-T14 | S-CQCC-N20 | R-PDIP-T14 | R-PDIP-T14 |
| 长度 | 9.21 mm | 6.2 mm | - | - | 19.56 mm | 8.89 mm | 19.305 mm | 19.305 mm |
| 负载电容（CL） | 150 pF | 150 pF | - | - | 150 pF | 150 pF | 150 pF | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | - | - | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | - | - | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | - | - | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 85 °C | - | - | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | - | - | -55 °C | -55 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DFP | SSOP | - | - | DIP | QCCN | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | SMALL OUTLINE, SHRINK PITCH | - | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 225 ns | 188 ns | - | - | 45 ns | 45 ns | 38 ns | 38 ns |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2 mm | - | - | 5.08 mm | 2.03 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | - | - | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | - | - | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | - | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | - | - | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | FLAT | GULL WING | - | - | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | - | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 6.29 mm | 5.3 mm | - | - | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm |
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