AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, TSOP-16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | TSOP |
| 包装说明 | TSSOP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | AHCT/VHCT |
| JESD-30 代码 | R-PDSO-G16 |
| 长度 | 4.4 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR |
| 数据/时钟输入次数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 宽度 | 3.6 mm |
| SN74AHCT123ADGV | SN74AHCT123APW | SN74AHCT123ADB | SN54AHCT123AW | SN54AHCT123AJ | |
|---|---|---|---|---|---|
| 描述 | AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, TSOP-16 | AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, TSSOP-16 | AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, SSOP-16 | AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CDFP16, CERAMIC, FP-16 | AHCT/VHCT SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CDIP16, CERAMIC, DIP-16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | TSOP | TSSOP | SOIC | DFP | DIP |
| 包装说明 | TSSOP, | TSSOP, | SSOP, | DFP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-GDFP-F16 | R-GDIP-T16 |
| 长度 | 4.4 mm | 5 mm | 6.2 mm | 10.2 mm | 19.56 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| 数据/时钟输入次数 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | TSSOP | TSSOP | SSOP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 12 ns | 12 ns | 12 ns | 14 ns | 14 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 2 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | GULL WING | GULL WING | GULL WING | FLAT | THROUGH-HOLE |
| 端子节距 | 0.4 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.6 mm | 4.4 mm | 5.3 mm | 6.73 mm | 7.62 mm |
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