EE PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Diodes |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 25 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e3 |
| 长度 | 31.75 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 133 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/3.3 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 7.62 mm |
| PEEL22LV10AZP-25L | PEEL22LV10AZT-25L | PEEL22LV10AZS-25L | PEEL22LV10AZJ-25L | PEEL22LV10AZJ-25 | PEEL22LV10AZT-25 | PEEL22LV10AZS-25 | PEEL22LV10AZP-25 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, 0.170 INCH, LEAD FREE, TSSOP-24 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, 0.300 INCH, LEAD FREE, SOIC-24 | EE PLD, 25ns, PAL-Type, CMOS, PQCC28, LEAD FREE, PLASTIC, LCC-28 | EE PLD, 25ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, 0.170 INCH, TSSOP-24 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, 0.300 INCH, SOIC-24 | EE PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Diodes | Diodes | Diodes | Diodes | Diodes | Diodes | Diodes | Diodes |
| 零件包装代码 | DIP | TSSOP | SOIC | QLCC | QLCC | TSSOP | SOIC | DIP |
| 包装说明 | DIP, DIP24,.3 | TSSOP, TSSOP24,.25 | SOP, SOP24,.4 | LEAD FREE, PLASTIC, LCC-28 | QCCJ, LDCC28,.5SQ | TSSOP, TSSOP24,.25 | SOP, SOP24,.4 | DIP, DIP24,.3 |
| 针数 | 24 | 24 | 24 | 28 | 28 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | S-PQCC-J28 | S-PQCC-J28 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e0 | e0 | e0 | e0 |
| 长度 | 31.75 mm | 7.8 mm | 15.4 mm | 11.5062 mm | 11.5062 mm | 7.8 mm | 15.4 mm | 31.75 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 133 | 133 | 133 | 133 | 133 | 133 | 133 | 133 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | SOP | QCCJ | QCCJ | TSSOP | SOP | DIP |
| 封装等效代码 | DIP24,.3 | TSSOP24,.25 | SOP24,.4 | LDCC28,.5SQ | LDCC28,.5SQ | TSSOP24,.25 | SOP24,.4 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 235 | NOT SPECIFIED | 245 | 245 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 | 10 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 4.4 mm | 7.5 mm | 11.5062 mm | 11.5062 mm | 4.4 mm | 7.5 mm | 7.62 mm |
| 座面最大高度 | - | 1.1 mm | 2.64 mm | 4.369 mm | 4.369 mm | 1.1 mm | 2.64 mm | - |
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