Power Factor Controller, Current-mode, 0.8A, BICMOS, GREEN, DIP-8
| 参数名称 | 属性值 |
| 厂商名称 | BCD Semi（Diodes） |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | POWER FACTOR CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 20 V |
| 最小输入电压 | 10.3 V |
| 标称输入电压 | 14.5 V |
| JESD-30 代码 | R-XDIP-T8 |
| 长度 | 9.2 mm |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 0.8 A |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.31 mm |
| 表面贴装 | NO |
| 切换器配置 | BOOST |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| AP1661P-G1 | AP1661MTR-G1 | AP1661MTR-E1 | AP1661M-E1 | AP1661P-E1 | AP1661M-G1 | |
|---|---|---|---|---|---|---|
| 描述 | Power Factor Controller, Current-mode, 0.8A, BICMOS, GREEN, DIP-8 | Power Factor Controller, Current-mode, 0.8A, BICMOS, PDSO8, GREEN, SOIC-8 | Power Factor Controller, Current-mode, 0.8A, BICMOS, PDSO8, ROHS COMPLIANT, SOIC-8 | Power Factor Controller, Current-mode, 0.8A, BICMOS, PDSO8, ROHS COMPLIANT, SOIC-8 | Power Factor Controller, Current-mode, 0.8A, BICMOS, ROHS COMPLIANT, DIP-8 | Power Factor Controller, Current-mode, 0.8A, BICMOS, PDSO8, GREEN, SOIC-8 |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP | SOIC |
| 包装说明 | DIP, | SOP, | SOP, | SOP, | DIP, | SOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | POWER FACTOR CONTROLLER | POWER FACTOR CONTROLLER | POWER FACTOR CONTROLLER | POWER FACTOR CONTROLLER | POWER FACTOR CONTROLLER | POWER FACTOR CONTROLLER |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| 最小输入电压 | 10.3 V | 10.3 V | 10.3 V | 10.3 V | 10.3 V | 10.3 V |
| 标称输入电压 | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V |
| JESD-30 代码 | R-XDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-XDIP-T8 | R-PDSO-G8 |
| 长度 | 9.2 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.2 mm | 4.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 0.8 A | 0.8 A | 0.8 A | 0.8 A | 0.8 A | 0.8 A |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.31 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.31 mm | 1.75 mm |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 切换器配置 | BOOST | BOOST | BOOST | BOOST | BOOST | BOOST |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| 厂商名称 | BCD Semi（Diodes） | - | - | BCD Semi（Diodes） | BCD Semi（Diodes） | BCD Semi（Diodes） |
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