HCPL-540x, 5962-89570, HCPL-543x,
HCPL-643x, 5962-89571
1
Hermetically Sealed, Very High Speed, Logic Gate
Optocouplers
Data Sheet
Description
These units are single and dual channel, hermetically sealed
optocouplers. The products are capable of operation and
storage over the full military temperature range and can be
purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Standard Microcircuit Drawing (SMD). All
devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and K devices are included in the DLA
Qualified Manufacturers List, QML-38534 for Hybrid
Microcircuits.
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 certified line
QML-38534, Class H and K
Two hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55° C to +125° C
High speed: 40 M bit/s
High common mode rejection 500 V/μs guaranteed
1500 Vdc withstand test voltage
Active (totem pole) outputs
Three stage output available
High radiation immunity
HCPL-2400/30 function compatibility
Reliability data
Compatible with TTL, STTL, LSTTL, and HCMOS logic
families
Applications
1.
See
Selection Guide – Lead Configuration Options
for available
extensions.
Military and space
High reliability systems
Transportation, medical, and life critical systems
Isolation of high-speed logic systems
Computer-peripheral interfaces
Switching power supplies
Isolated bus driver (networking applications) – (5400/1/K
only)
Pulse transformer replacement
Ground loop elimination
Harsh industrial environments
High-speed disk drive I/O
Digital isolation for A/D, D/A conversion
Broadcom
-1-
HCPL-540x, 5962-89570, HCPL-543x, HCPL-643x, 5962-89571
Data Sheet
Functional Diagram
Functional Diagram
Multiple-channel devices available.
V
CC
V
E
V
O
GND
Each channel contains an AlGaAs light emitting diode, which is
optically coupled to an integrated high gain photon detector.
This combination results in very high data rate capability. The
detector has a threshold with hysteresis, which typically
provides 0.25 mA of differential mode noise immunity and
minimizes the potential for output signal chatter. The detector
in the single-channel units has a three-state output stage that
eliminates the need for a pull-up resistor and allows for direct
drive of a data bus.
All units are compatible with TTL, STTL, LSTTL, and HCMOS
logic families. The 35-ns pulse width distortion specification
guarantees a 10 MBd signaling rate at +125°C with 35% pulse
width distortion.
Figure 13
through
Figure 16
show
recommended circuits for reducing pulse width distortion and
optimizing the signal rate of the product. Package styles for
these parts are 8-pin DIP through hole (case outlines P) and
leadless ceramic chip carrier (case outline 2). Devices can be
purchased with a variety of lead bend and plating options. See
Selection Guide – Lead Configuration Options
for details.
Standard Microcircuit Drawing (SMD) parts are available for
each package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are similar for all parts.
Occasional exceptions exist due to package variations and
limitations and are as noted. Additionally, the same package
assembly processes and materials are used in all devices. These
similarities give justification for the use of data obtained from
one part to represent other part’s performance for die related
reliability and certain limited radiation test results.
Truth Tables
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single-Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
L
L
H
H
Output
L
H
Z
Z
NOTE
The connection of a 0.1-μF bypass capacitor
between V
CC
and GND is recommended.
Broadcom
-2-
HCPL-540x, 5962-89570, HCPL-543x, HCPL-643x, 5962-89571
Data Sheet
Selection Guide – Lead Configuration Options
Selection Guide – Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Part Number and Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
b
Butt Cut/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
a.
b.
Solder lead finish: Sn63/Pb37.
8-Pin DIP
Through Hole
1
None
8-Pin DIP
Through Hole
2
V
CC
, GND
HCPL-5430
HCPL-5431
HCPL-543K
Gold Plate
a
Option 200
Option 100
Option 300
20-Pad LCCC
Surface Mount
2
None
HCPL-5400
HCPL-5401
HCPL-540K
Gold Plate
a
Option 200
Option 100
Option 300
HCPL-6430
HCPL-6431
HCPL-643K
Solder Pads
b
5962-
8957001PC
8957001PA
8957001YC
8957001YA
8957001XA
5962-
8957101PC
8957101PA
8957101YC
8957101YA
8957101XA
5962-
89571022A
5962-
8957002KPC
8957002KPA
8957002KYC
8957002KYA
8957002KXA
5962-
8957103KPC
8957103KPA
8957103KYC
8957103KYA
8957103KXA
5962-
8957104K2A
Gold plate lead finish: Maximum gold thickness of leads is <100 micro-inches. Typical is 60 to 90 micro-inches.
Broadcom
-3-
HCPL-540x, 5962-89570, HCPL-543x, HCPL-643x, 5962-89571
Data Sheet
Functional Diagrams
Functional Diagrams
8-Pin DIP
Through Hole
1 Channel
Through Hole
2 Channels
8-Pin DIP
Surface Mount
2 Channels
20-Pad LCCC
1
2
3
4
V
CC
V
E
V
O
GND
8
7
6
5
1
2
3
4
V
CC
V
O1
V
O2
8
7
6
5
19
20
2
3
15
V
CC2
V
O2
GND
2
V
O1
GND
1
7 8
13
12
V
CC1
10
GND
NOTE
All DIP devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels
with separate V
CC
and ground connections. All diagrams are top view.
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
Avago QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
X 50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago FSCN
[1]
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
Avago QYYWWZ
XXXXXX
X XXXX
XXXXXX
XXX 50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD
[1]
DLA SMD
[1]
Avago FSCN
[1]
Broadcom
-4-
HCPL-540x, 5962-89570, HCPL-543x, HCPL-643x, 5962-89571
Data Sheet
Outline Drawings
Outline Drawings
20-Terminal LCCC Surface Mount, 2 Channels
8.69 (0.342)
9.09 (0.358)
4.95 (0.195)
5.21 (0.205)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
1.78 (0.070)
2.03 (0.080)
8.69 (0.342)
9.09 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
Note: Dimensions in millimeters (inches).
Solder thickness 0.127 (0.005) max.
8-Pin DIP Through Hole, 1 and 2 Channel
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
Note: Dimensions in millimeters (inches).
7.36 (0.290)
7.87 (0.310)
Broadcom
-5-
微控制器 MCU
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