Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-XDFP-F16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
74S258FC | 74S258PC | 54LS258FM | 74S258DC | 54S258DMQB | 74LS258PC | |
---|---|---|---|---|---|---|
描述 | Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16, | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16, | Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16, | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16, | Multiplexer, S Series, 1-Func, 8 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknow |
JESD-30 代码 | R-XDFP-F16 | R-PDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | R-CDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 4 | 4 | 4 | 4 | 1 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 8 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DFP | DIP | DFP | DIP | DIP | DIP |
封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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