MBM29LV200TC
-70/-90
/
MBM29LV200BC
-70/-90
Data Sheet
(Retired Product)
MBM29LV200TC
90-70/-90
Cover Sheet
/MBM29LV200BC
-70/-
This product has been retired and is not recommended for new designs. Availability of this document is retained for reference
and historical purposes only.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been
made are the result of normal data sheet improvement and are noted in the document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number
MBM29LV200TC/BC
Revision
DS05-20865-6E
Issue Date
July 31, 2007
Data
Sheet
(R etired
Produ ct)
This page left intentionally blank.
2
MBM29LV200TC/BC_DS05-20865-6E July 31, 2007
SPANSION
Data Sheet
TM
Flash Memory
September 2003
TM
This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,
these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a SPANSION
TM
product. Future routine
revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about SPANSION
solutions.
TM
memory
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20865-6E
FLASH MEMORY
CMOS
2M (256K
×
8/128K
×
16) BIT
MBM29LV200TC
-70/-90
/MBM29LV200BC
-70/-90
■
GENERAL DESCRIPTION
The MBM29LV200TC/BC are a 8M-bit, 3.0 V-only Flash memory organized as 256K bytes of 8 bits each or 128K
words of 16 bits each. The MBM29LV200TC/BC are offered in 48-pin TSOP(1) and 44-pin SOP packages. These
devices are designed to be programmed in-system with the standard system 3.0 V V
CC
supply. 12.0 V V
PP
and
5.0 V V
CC
are not required for write or erase operations. The devices can also be reprogrammed in standard
EPROM programmers.
The standard MBM29LV200TC/BC offer access times 70 ns and 120 ns, allowing operation of high-speed micro-
processors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write
enable (WE), and output enable (OE) controls.
(Continued)
Part No.
V
CC
= 3.3 V
Ordering Part No.
V
CC
= 3.0 V
Max Address Access Time (ns)
Max CE Access Time (ns)
Max OE Access Time (ns)
+0.3 V
–0.3 V
+0.6 V
–0.3 V
■
PRODUCT LINE UP
MBM29LV200TC/MBM29LV200BC
−70
—
70
70
30
—
−90
90
90
35
■
PACKAGES
48-pin plastic TSOP(1)
Marking Side
48-pin plasticTSOP(1)
44-pin plastic SOP
Marking Side
Marking Side
(FPT-48P-M19)
(FPT-48P-M20)
(FPT-44P-M16)
Retired Product DS05-20865-6E_July 31, 2007
MBM29LV200TC/200BC
-70/90
(Continued)
The MBM29LV200TC/BC are pin and command set compatible with JEDEC standard E
2
PROMs. Commands
are written to the command register using standard microprocessor write timings. Register contents serve as
input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and erase operations. Reading data out of the devices
is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.
The MBM29LV200TC/BC are programmed by executing the program command sequence. This will invoke the
Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths
and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds.
Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase
Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed
before executing the erase operation. During erase, the devices automatically time the erase pulse widths and
verify proper cell margin.
A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.)
The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The MBM29LV200TC/BC are erased when shipped from the
factory.
The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low V
CC
detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ
7
,
by the Toggle Bit feature on DQ
6
, or the RY/BY output pin. Once the end of a program or erase cycle has been
completed, the devices internally reset to the read mode.
Fujitsu’s Flash technology combines years of EPROM and E
2
PROM experience to produce the highest levels
of quality, reliability, and cost effectiveness. The MBM29LV200TC/BC memories electrically erase the entire chip
or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one
byte/word at a time using the EPROM programming mechanism of hot electron injection.
Retired Product DS05-20865-6E_July 31, 2007
5
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