EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ABLIC |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | DATA RETENTION: 10 YEARS |
最大时钟频率 (fCLK) | 2 MHz |
数据保留时间-最小值 | 10 |
耐久性 | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 5.02 mm |
内存密度 | 4096 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.8/6.5 V |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
串行总线类型 | MICROWIRE |
最大待机电流 | 4e-7 A |
最大压摆率 | 0.0025 mA |
最大供电电压 (Vsup) | 6.5 V |
最小供电电压 (Vsup) | 2.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
最长写入周期时间 (tWC) | 10 ms |
写保护 | HARDWARE/SOFTWARE |
S-29394AFJA | S-29394AFJ | S-29394ADPA | S-29394ADP | S-29194AFJA | S-29294AFJ | S-29294ADPA | |
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描述 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP1-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
零件包装代码 | SOIC | SOIC | DIP | DIP | SOIC | SOIC | DIP |
包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS |
最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 5.02 mm | 4.9 mm | 9.3 mm | 9.5 mm | 5.02 mm | 4.9 mm | 9.3 mm |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 1024 bit | 2048 bit | 2048 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 256 words | 256 words | 256 words | 256 words | 64 words | 128 words | 128 words |
字数代码 | 256 | 256 | 256 | 256 | 64 | 128 | 128 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X16 | 256X16 | 256X16 | 256X16 | 64X16 | 128X16 | 128X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | SOP | SOP | DIP |
封装等效代码 | SOP8,.25 | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 4.5 mm | 3.94 mm | 1.75 mm | 1.75 mm | 4.5 mm |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | 3-WIRE | MICROWIRE |
最大待机电流 | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A |
最大压摆率 | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA |
最大供电电压 (Vsup) | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
最小供电电压 (Vsup) | 2.5 V | 1.8 V | 2.5 V | 1.8 V | 2.5 V | 1.8 V | 2.5 V |
标称供电电压 (Vsup) | 5 V | 2.5 V | 5 V | 2.5 V | 5 V | 2.5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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