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M5-256/160-7HC

产品描述EE PLD, 12ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208
产品类别可编程逻辑器件    可编程逻辑   
文件大小882KB,共40页
制造商AMD(超微)
官网地址http://www.amd.com
下载文档 详细参数 选型对比 全文预览

M5-256/160-7HC概述

EE PLD, 12ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208

M5-256/160-7HC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称AMD(超微)
零件包装代码QFP
包装说明HFQFP, HQFP208,1.2SQ,20
针数208
Reach Compliance Codeunknown
其他特性PAL BLOCKS INTERCONNECTED BY PIA
最大时钟频率71 MHz
系统内可编程YES
JESD-30 代码S-PQFP-G208
JESD-609代码e0
JTAG BSTYES
长度28 mm
专用输入次数
I/O 线路数量160
宏单元数256
端子数量208
最高工作温度70 °C
最低工作温度
组织0 DEDICATED INPUTS, 160 I/O
输出函数MACROCELL
封装主体材料PLASTIC/EPOXY
封装代码HFQFP
封装等效代码HQFP208,1.2SQ,20
封装形状SQUARE
封装形式FLATPACK, HEAT SINK/SLUG, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
可编程逻辑类型EE PLD
传播延迟12 ns
认证状态Not Qualified
座面最大高度3.7 mm
最大供电电压5.25 V
最小供电电压4.75 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度28 mm

M5-256/160-7HC相似产品对比

M5-256/160-7HC M5-256/160-15HC M5-256/160-12HC M5-256/160-20HI M5-256/160-10HC M5-256/160-15HI M5-256/160-12HI M5-256/160-10HI
描述 EE PLD, 12ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 18ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 16ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 20ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 14ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 18ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 16ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 EE PLD, 14ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 AMD(超微) AMD(超微) AMD(超微) AMD(超微) AMD(超微) AMD(超微) AMD(超微) AMD(超微)
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20 HFQFP, HQFP208,1.2SQ,20
针数 208 208 208 208 208 208 208 208
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA PAL BLOCKS INTERCONNECTED BY PIA
最大时钟频率 71 MHz 42 MHz 47.6 MHz 50 MHz 58 MHz 59 MHz 67 MHz 83 MHz
系统内可编程 YES YES YES YES YES YES YES YES
JESD-30 代码 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
JTAG BST YES YES YES YES YES YES YES YES
长度 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm
I/O 线路数量 160 160 160 160 160 160 160 160
宏单元数 256 256 256 256 256 256 256 256
端子数量 208 208 208 208 208 208 208 208
最高工作温度 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C
组织 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 160 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HFQFP HFQFP HFQFP HFQFP HFQFP HFQFP HFQFP HFQFP
封装等效代码 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20 HQFP208,1.2SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, HEAT SINK/SLUG, FINE PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
可编程逻辑类型 EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 12 ns 18 ns 16 ns 20 ns 14 ns 18 ns 16 ns 14 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.7 mm 3.7 mm 3.7 mm 3.7 mm 3.7 mm 3.7 mm 3.7 mm 3.7 mm
最大供电电压 5.25 V 5.25 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.75 V 4.75 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm

 
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