EE PLD, 12ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | QFP |
包装说明 | HFQFP, HQFP208,1.2SQ,20 |
针数 | 208 |
Reach Compliance Code | unknown |
其他特性 | PAL BLOCKS INTERCONNECTED BY PIA |
最大时钟频率 | 71 MHz |
系统内可编程 | YES |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e0 |
JTAG BST | YES |
长度 | 28 mm |
专用输入次数 | |
I/O 线路数量 | 160 |
宏单元数 | 256 |
端子数量 | 208 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 0 DEDICATED INPUTS, 160 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HFQFP |
封装等效代码 | HQFP208,1.2SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 12 ns |
认证状态 | Not Qualified |
座面最大高度 | 3.7 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 28 mm |
M5-256/160-7HC | M5-256/160-15HC | M5-256/160-12HC | M5-256/160-20HI | M5-256/160-10HC | M5-256/160-15HI | M5-256/160-12HI | M5-256/160-10HI | |
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描述 | EE PLD, 12ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 18ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 16ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 20ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 14ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 18ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 16ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | EE PLD, 14ns, 256-Cell, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP208,1.2SQ,20 |
针数 | 208 | 208 | 208 | 208 | 208 | 208 | 208 | 208 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA | PAL BLOCKS INTERCONNECTED BY PIA |
最大时钟频率 | 71 MHz | 42 MHz | 47.6 MHz | 50 MHz | 58 MHz | 59 MHz | 67 MHz | 83 MHz |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES |
长度 | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm |
I/O 线路数量 | 160 | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
宏单元数 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
端子数量 | 208 | 208 | 208 | 208 | 208 | 208 | 208 | 208 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
组织 | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP |
封装等效代码 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 12 ns | 18 ns | 16 ns | 20 ns | 14 ns | 18 ns | 16 ns | 14 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm | 28 mm |
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