Sample and Hold Circuit, 1 Func, Track, 2.5us Acquisition Time, Hybrid, CDIP14, CERAMIC, DIP-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Spectrum Microwave |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长采集时间 | 4 µs |
| 标称采集时间 | 2.5 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 10 V |
| 最小模拟输入电压 | -10 V |
| 最大下降率 | 100 V/s |
| JESD-30 代码 | R-CDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 20.257 mm |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 5.258 mm |
| 最大压摆率 | 24 mA |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MN374 | MN374H | MN374H/BCH | MN374H/B | |
|---|---|---|---|---|
| 描述 | Sample and Hold Circuit, 1 Func, Track, 2.5us Acquisition Time, Hybrid, CDIP14, CERAMIC, DIP-14 | Sample and Hold Circuit, 1 Func, Track, 2.5us Acquisition Time, Hybrid, CDIP14, CERAMIC, DIP-14 | Sample and Hold Circuit, 1 Func, Track, 2.5us Acquisition Time, Hybrid, CDIP14, CERAMIC, DIP-14 | Sample and Hold Circuit, 1 Func, Track, 2.5us Acquisition Time, Hybrid, CDIP14, CERAMIC, DIP-14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
| 零件包装代码 | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| 针数 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长采集时间 | 4 µs | 4 µs | 4 µs | 4 µs |
| 标称采集时间 | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 10 V | 10 V | 10 V | 10 V |
| 最小模拟输入电压 | -10 V | -10 V | -10 V | -10 V |
| 最大下降率 | 100 V/s | 500 V/s | 500 V/s | 500 V/s |
| JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 20.257 mm | 20.257 mm | 20.257 mm | 20.257 mm |
| 负供电电压上限 | -18 V | -18 V | -18 V | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 5.258 mm | 5.258 mm | 5.258 mm | 5.258 mm |
| 最大压摆率 | 24 mA | 24 mA | 24 mA | 24 mA |
| 供电电压上限 | 18 V | 18 V | 18 V | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
