S-201001DR-200概述

MASK ROM, 128KX8, 200ns, CMOS, PDIP32, DIP-32

S-201001DR-200规格参数

	S-201001DR-200	S-201001CR-200	S-201001CRC-200	S-201001DRC-200
描述	MASK ROM, 128KX8, 200ns, CMOS, PDIP32, DIP-32	MASK ROM, 128KX8, 200ns, CMOS, PDIP32, DIP-32	MASK ROM, 128KX8, 200ns, CMOS	MASK ROM, 128KX8, 200ns, CMOS
厂商名称	ABLIC	ABLIC	ABLIC	ABLIC
包装说明	DIP, DIP32,.6	DIP, DIP32,.6	, DIE OR CHIP	, DIE OR CHIP
Reach Compliance Code	compliant	compliant	compliant	compliant
最长访问时间	200 ns	200 ns	200 ns	200 ns
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8
字数	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000
最高工作温度	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8
封装等效代码	DIP32,.6	DIP32,.6	DIE OR CHIP	DIE OR CHIP
电源	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.0001 A	0.0001 A	0.0001 A	0.0001 A
最大压摆率	0.04 mA	0.04 mA	0.04 mA	0.04 mA
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V
技术	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL

器件捷径: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ