256KX8 MASK PROM, 200ns, PDIP40, PLASTIC, DIP-40
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| 备用内存宽度 | 16 |
| JESD-30 代码 | R-PDIP-T40 |
| 长度 | 52.8 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| HN62412P | HN62412FP | HN62422FP | HN62422TFP | HN62412TFP | HN62422P | |
|---|---|---|---|---|---|---|
| 描述 | 256KX8 MASK PROM, 200ns, PDIP40, PLASTIC, DIP-40 | 256KX8 MASK PROM, 200ns, PQFP44, PLASTIC, QFP-44 | 256KX8 MASK PROM, 150ns, PQFP44, PLASTIC, QFP-44 | 256KX8 MASK PROM, 150ns, PQFP44, PLASTIC, TQFP-44 | 256KX8 MASK PROM, 200ns, PQFP44, PLASTIC, TQFP-44 | 256KX8 MASK PROM, 150ns, PDIP40, PLASTIC, DIP-40 |
| 零件包装代码 | DIP | QFP | QFP | QFP | QFP | DIP |
| 包装说明 | DIP, | QFP, | QFP, | TQFP, | TQFP, | DIP, |
| 针数 | 40 | 44 | 44 | 44 | 44 | 40 |
| Reach Compliance Code | unknown | compli | unknown | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 200 ns | 150 ns | 150 ns | 200 ns | 150 ns |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | R-PDIP-T40 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 |
| 长度 | 52.8 mm | 14 mm | 14 mm | 14 mm | 14 mm | 52.8 mm |
| 内存密度 | 2097152 bit | 2097152 bi | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 44 | 44 | 44 | 44 | 40 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QFP | QFP | TQFP | TQFP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 3.05 mm | 3.05 mm | 1.1 mm | 1.1 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| 宽度 | 15.24 mm | 14 mm | 14 mm | 14 mm | 14 mm | 15.24 mm |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
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