LS SERIES, QUAD 2-INPUT NAND GATE, CDIP14
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | not_compliant |
| SN74LS01J | SN7401N | SN54LS01W | SN54H01W | SN74H01N | SN74H01J | SN74LS01FN | |
|---|---|---|---|---|---|---|---|
| 描述 | LS SERIES, QUAD 2-INPUT NAND GATE, CDIP14 | Quad 2-input Positive-NAND gates with open collector outputs 14-PDIP 0 to 70 | LS SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 | TTL/H/L SERIES, QUAD 2-INPUT NAND GATE, CDFP14 | TTL/H/L SERIES, QUAD 2-INPUT NAND GATE, PDIP14 | TTL/H/L SERIES, QUAD 2-INPUT NAND GATE, CDIP14 | LS SERIES, QUAD 2-INPUT NAND GATE, PQCC20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 系列 | - | TTL/H/L | LS | TTL/H/L | TTL/H/L | TTL/H/L | LS |
| JESD-30 代码 | - | R-PDIP-T14 | R-GDFP-F14 | R-GDFP-F14 | R-PDIP-T14 | R-GDIP-T14 | S-PQCC-J20 |
| 长度 | - | 19.305 mm | 9.21 mm | 9.21 mm | 19.305 mm | 19.56 mm | 8.9662 mm |
| 负载电容（CL） | - | 15 pF | 15 pF | 25 pF | 25 pF | 25 pF | 15 pF |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | - | 14 | 14 | 14 | 14 | 14 | 20 |
| 最高工作温度 | - | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | - | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | - | DIP | DFP | DFP | DIP | DIP | QCCJ |
| 封装等效代码 | - | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | LDCC20,.4SQ |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | - | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大电源电流（ICC） | - | 22 mA | 4.4 mA | 40 mA | 40 mA | 40 mA | 4.4 mA |
| 传播延迟（tpd） | - | 55 ns | 28 ns | 12 ns | 12 ns | 12 ns | 28 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | - | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | 5.08 mm | 4.57 mm |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | YES | YES | NO | NO | YES |
| 技术 | - | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | - | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 6.29 mm | 6.29 mm | 7.62 mm | 7.62 mm | 8.9662 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
