SURFACE MOUNT
Small in size and light in weight
Electrical stability and high reliability
Excellent mechanical strength and high frequency
characteristics
Reduction of assembly costs and matching with auto
placement machines
Hybrid thick and thin integrated circuits
Telecommunication equipment
Computers
SURFACE MOUNT CHIP RESISTOR RPC
OUTLINE DRAWING
L
T
T
CONSTRUCTION
Protective Coating
Output Termination
Layer: Solder
W
Middle Termination
Layer: Sn
Inner Termination
Layer: Sn
High Purity
Alumina Substrate
Resistive Element (Ru0 )
2
H
t
t
H
Range
RPC04
RPC16
RPC12
RPC25
RPC33
RPC50
RPC100
Size Code
0402
0603
0805
1206
1210
2010
2512
Length L (mm)
1.00 ± 0.10
1.60 ± 0.10
2.00 ± 0.10
3.10 ± 0.10
3.10 ± 0.10
5.00 ± 0.10
6.35 ± 0.10
Width W (mm)
0.50 ± 0.05
0.80 ± 0.10
1.25 ± 0.10
1.60 ± 0.10
2.60 ± 0.15
2.50 ± 0.15
3.20 ± 0.15
Height H (mm)
0.35 ± 0.05
0.45 ± 0.1
0.50 ± 0.1
0.55 ± 0.1
0.55 ± 0.1
0.55 ± 0.1
0.55 ± 0.1
Terminal T (mm)
0.20 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.50 ± 0.25
0.50 ± 0.25
0.60 ± 0.25
0.60 ± 0.25
Terminal t (mm)
0.25 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.50 ± 0.25
0.5 ± 0.20
0.5 ± 0.20
0.5 ± 0.20
ORDERING INFORMATION
RPC
Range
25
Size
04=0402
16 = 0603
12 = 0805
25 = 1206
33 = 1210
50 = 2010
100 = 2512
103
Value
J
Tolerance
F = ± 1%
J = ± 5%
Remark: E96 is only available for 1%
137
Fax: 01371 875075
www.dubilier.co.uk
Tel: 01371 875758
SECTION 4
SURFACE MOUNT
SURFACE MOUNT CHIP RESISTOR RPC
OTHER SPECIFICATIONS & TEST METHODS
PERFORMANCE TEST
Temperature coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
Insulation Resistance
Dielectric Withstand Voltage
Resistance to Soldering Heat
Moisture Resistance
Life
Resistance to Soldering Heat
Bending Strength
TEST METHOD
MIL-STD-202F, Method 304
-55˚C to +125˚C
MIL-STD-202F, Method 107
5 Cycles, -55˚C to +125˚C (Step by Step 2 min)
MIL-R-55342D, Para.4.7.4
One Hour at -65˚C Followed by 45 min RCWV
MIL-R-55342D, Para.4.7.5
2.5 Times RCWV for 5 Seconds
MIL-STD-202F, Method 302
RCOV for 1 minute
MIL-STD-202F, Method 301
R.M.S for 1 minute
MIL-STD-202F, Method 210C Soldered to Test Board at 260˚C for 10 Seconds
MIL-STD-202F, Method 160F 42 Cycles. Total 1000 Hours
MIL-STD-202F, Method 108A 1000 Hours at 70˚C RCWV Intermittent
MIL-STD-202F, Method 210C 260˚C, for 5 Seconds
JIS-C-5202, Para.6.1.4, Unit Mounted in Centre of 90mm Board Length
Deflected 5mm (power chip 2mm) in Either Direction for 5 Seconds
1% TOL.
by Type
±(0.5%+0.05Ω)
±(0.5%+0.05Ω)
±(1%+0.05Ω)
10000MΩ
by Type
±(0.5%+0.05Ω)
±(0.5%+0.05Ω)
±(1%+0.05Ω)
95% min. coverage
±(1%+0.05Ω)
5% TOL.
by Type
±(1%+0.05Ω)
±(1%+0.05Ω)
±(2%+0.05Ω)
10000MΩ
by Type
±(1%+0.05Ω)
±(2%+0.05Ω)
±(3%+0.05Ω)
95% min. coverage
±(1%+0.05Ω)
For taping and packaging specification please see the RTF range.
139
Fax: 01371 875075
www.dubilier.co.uk
Tel: 01371 875758
SECTION 4
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