CMF01
TOSHIBA Fast Recovery Diode
Silicon Diffused Type
CMF01
Switching Mode Power Supply Applications
DC/DC Converter Applications
Repetitive peak reverse voltage: V
RRM
= 600 V
•
Average forward current: I
F (AV)
= 2.0 A
•
Forward voltage: V
FM
= 2.0 V (max)
•
Very fast reverse-recovery time: t
rr
= 100 ns (max.)
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, M−FLAT
TM
Unit: mm
②
①
0.16
Characteristic
Repetitive peak reverse voltage
Average forward current
Peak one-cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
600
2.0 (Note 1)
30 (50 Hz)
−40
to 150
−40
to 150
Unit
V
A
A
°C
°C
1.75
±
0.1
+ 0.2
2.4
−
0.1
0.98
±
0.1
0 ~ 0.1
①
ANODE
②
CATHODE
JEDEC
JEITA
TOSHIBA
⎯
⎯
3-4E1A
Note 1: Tℓ =100°C
Device mounted on a ceramic board
Board size: 50 mm × 50 mm,
Soldering land size: 2 mm × 2 mm
Board thickness: 0.64 mm
Rectangular waveform (α = 180°)
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2008-05-13
0.65
±
0.2
Absolute Maximum Ratings
(Ta
=
25°C)
3.8
±
0.1
4.7
±
0.2
0.65
±
0.2
CMF01
Electrical Characteristics
(Ta
=
25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Symbol
V
FM
I
RRM
t
rr
t
fr
Test Condition
I
FM
=
2.0 A (pulse test)
V
RRM
=
600 V (pulse test)
I
F
= 1 A, di/dt =-30 A/μs
I
F
= 1 A
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 mm)
Thermal resistance (junction to lead)
R
th (j-ℓ)
⎯
Min
⎯
⎯
⎯
⎯
⎯
Typ.
1.4
⎯
⎯
270
⎯
Max
2.0
50
100
⎯
Unit
V
μA
ns
ns
60
Thermal resistance
R
th (j-a)
⎯
⎯
135
°C/W
⎯
⎯
210
⎯
⎯
16
°C/W
Marking
Abbreviation Code
Part No.
Standard Soldering Pad
Unit: mm
F1
CMF01
2.1
1.4
3.0
1.4
Handling Precautions
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods we recommend for designing a
circuit using this device.
V
RRM
: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of V
RRM
for a DC circuit; and no greater than 50% of that of V
RRM
for an AC circuit.
V
RRM
has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when
designing a device for use at low temperature.
I
F(AV)
: We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of I
F
(AV).
Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by
using an allowable Ta max- I
F (AV)
curve.
This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore
the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.
For this device, we recommend Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
2
2008-05-13
CMF01
i
F
– v
F
100
Pulse test
2.8
P
F (AV)
– I
F (AV)
i
F
(A)
10
150°C
75°C
Tj
=
25°C
Average forward power dissipation
P
F (AV)
(W)
2.4
2.0
1.6
1.2
0.8
0.4
0
0
0°
α
360°
Conduction angle
α
α =
60°
120°
Rectangular
waveform
Instantaneous forward current
180°
1
0.1
0.01
0
1.0
2.0
3.0
4.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
Instantaneous forward voltage VF
(V)
Average forward current
I
F (AV)
(A)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm, land size: 6 mm × 6 mm)
160
160
Ta max – I
F (AV)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm, land size: 2 mm × 2 mm)
T
ℓ
max – I
F (AV)
Maximum allowable ambient temperature
Ta max (°C)
140
120
100
80
60
120°
40
20
0
0
α =
60°
0°
α
360°
180°
Conduction
angle:
α
1.6
2.0
2.4
2.8
Rectangular
waveform
Maximum allowable lead temperature
T
ℓ
max (°C)
140
120
100
80
60
40
0°
α
360°
20
0
0
Conduction
angle:
α
0.4
0.8
1.2
1.6
2.0
2.4
2.8
α =
60°
Rectangular
waveform
120°
180°
0.4
0.8
1.2
Average forward current
I
F (AV)
(A)
Average forward current
I
F (AV)
(A)
Surge forward current
(non-repetitive)
40
1000
Ta
=
25°C
f
=
50 Hz
30
r
th (j-a)
– t
Device mounted on
a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 2.1 mm × 1.4 mm,
board thickness: 1.6 mm)
I
FSM
(A)
Peak surge forward current
Transient thermal impedance
r
th (j-a)
(°C/W)
100
Device mounted on
a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 6 mm × 6 mm,
board thickness: 1.6 mm)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
land size: 2 mm × 2 mm,
board thickness: 0.64 mm)
1
0.001
0.01
0.1
1
10
100
1000
20
10
10
0
1
10
100
Number of cycles
Time t (s)
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2008-05-13
CMF01
RESTRICTIONS ON PRODUCT USE
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
•
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
•
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
4
2008-05-13
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