CMF03
TOSHIBA Fast Recovery Diode Silicon Diffused Type
CMF03
○
High-Speed Rectification (Fast recovery)
○
Radio-Frequency Rectification in Switching Regulators
○
DC-DC Converters
•
•
•
•
•
Repetitive peak reverse voltage
Average forward current
Peak forward voltage
Very fast reverse-recovery time
: V
RRM
= 900 V
: I
F (AV)
= 0.5 A
: V
FM
= 2.5 V (max)
: t
rr
= 100 ns (max)
Unit: mm
Suitable for high-density board assembly due to the use of a small
Toshiba Nickname: M−FLAT
TM
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristic
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak forward surge current
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F(AV)
I
FSM
T
j
T
stg
Rating
900
0.5 (Note 1)
10 (50 Hz)
−40
to 125
−40
to 150
Unit
V
A
A
°C
°C
①
ANODE
②
CATHODE
JEDEC
JEITA
TOSHIBA
3-4E1S
Note 1: T
ℓ
=
102°C
Rectangular waveform (α
=
180°)
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Symbol
V
FM
I
RRM
t
rr
t
fr
Test Condition
I
FM
=
0.5 A (pulse test)
V
RRM
=
900 V (pulse test)
I
F
= 1 A, di/dt = -30 A/µs
I
F
= 1 A
Device mounted on a ceramic board
board size
50 mm
×
50 mm
soldering land size
2 mm
×
2 mm
board thickness
0.64 mm
Thermal resistance
R
th(j-a)
Device mounted on a glass-epoxy board
board size
50 mm
×
50 mm
soldering land size
6 mm
×
6 mm
board thickness
1.6 mm
Device mounted on a glass-epoxy board
board size
50 mm
×
50 mm
soldering land size
2.1 mm
×
1.4 mm
board thickness
1.6 mm
Thermal resistance (junction to lead)
R
th(j-ℓ)
Min
Typ.
550
Max
2.5
50
100
60
Unit
V
μA
ns
ns
135
°C/W
210
16
°C/W
Start of commercial production
1
2006-12
2019-03-07
CMF03
Marking
Abbreviation Code
F3
Part No.
CMF03
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
Usage Considerations
1) The absolute maximum ratings are rated values that must not be exceeded for a moment to have you use an element
safely. Please refer to each following absolute maximum ratings on the occasion of use and design.
V
RRM
: In DC circuit, the voltage peaks of applied voltage must be rated less than 80 % absolute maximum ratings.
In AC circuit, the voltage peaks of applied voltage must be rated less than 50 % absolute maximum ratings.
And, V
RRM
has a temperature coefficient of 0.1 %/℃.
Please take this coefficient into account when designing a circuit board that will be operated in
a low-temperature environment.
I
F(AV)
: We recommend that the current be in less than 80 % of rating and the junction temperature (T
j
)
be in less than 80 % of absolute maximum rating under the worst condition.
This rating is based on the premise that the device is radiating heat enough.
Therefore, when enough heat radiation is not expected, please consider the margin to the
permission curve of T
a(max)
- I
F(AV)
for using the device.
I
FSM
: This rating specifies a non-repetitive limit value.
This only applies to an abnormal operation, which seldom occurs during the lifespan of a device.
T
j
: Derate device parameters in proportion to this rating in order to ensure high reliability.
We recommend that the junction temperature (T
j
) of a device be kept below 80 %.
2)
Thermal resistance (junction-to-ambient) varies with the mounting conditions of the device on the circuit board. An
appropriate thermal resistance value that should be used, must be considering the circuit board design and soldering
land size.
3)
For other design considerations, see the Toshiba website.
2.1
2
2019-03-07
CMF03
RESTRICTIONS ON PRODUCT USE
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Hardware, software and systems described in this document are collectively referred to as “Product”.
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
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including without limitation, the EU RoHS Directive.
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
RESTRICTIONS ON P
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2019-03-07
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