Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> PCX107AMZFU100LC

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PCX107AMZFU100LC: 产品描述Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小45KB，共2页; 制造商Atmel (Microchip)

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PCX107AMZFU100LC概述

Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503

PCX107AMZFU100LC规格参数

参数名称	属性值
厂商名称	Atmel (Microchip)
零件包装代码	BGA
包装说明	BGA,
针数	503
Reach Compliance Code	unknown
其他特性	ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	32
边界扫描	YES
总线兼容性	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X
最大时钟频率	66 MHz
外部数据总线宽度	64
JESD-30 代码	S-PBGA-B503
长度	33 mm
I/O 线路数量
端子数量	503
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	SQUARE
封装形式	GRID ARRAY
认证状态	Not Qualified
座面最大高度	2.75 mm
最大供电电压	2.625 V
最小供电电压	2.375 V
标称供电电压	2.5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
宽度	33 mm

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The PC107 PCI Bridge/Integrated Memory Controller provides a bridge between the Peripheral Component

Interconnect (PCI) bus and PC6xx, PC7xx, and PC74xx microprocessors. PCI support allows system designers

to design systems quickly using peripherals already designed for PCI and the other standard interfaces available

in the personal computer hardware environment. The PC107 provides many of the other necessities for

embedded applications, including a high-performance memory controller and dual-processor support; two-

channel flexible DMA controller; an interrupt controller; an I

O-ready message unit; an inter-integrated circuit

controller (I

C); and low-skew clock drivers. The PC107 contains an Embedded Programmable Interrupt

Controller (EPIC) featuring five hardware interrupts (IRQs) as well as 16 serial interrupts along with four timers.

The PC107 uses an advanced, 2.5V HiP3 process technology and is fully compatible with TTL devices.

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- Four levels of power reduction–doze, nap, sleep, and suspend

- Fully static, internal logic states preserved during all power modes

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The memory interface controls processor and PCI interactions to main memory.

It supports a variety of programmable timing supporting DRAM (FPM, EDO), SDRAM,

and ROM/Flash ROM configurations, up to speeds of 100 MHz.

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The PC107 PCI interface is designed to connect the processor and memory buses to the

PCI local bus without the need for “glue” logic at speeds up to 66 MHz.

The PC107 acts as either a master or slave device on the PCI bus and contains a PCI

bus arbitration unit which reduces the need for an equivalent external unit, thus reducing

the total system complexity and cost.

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The PC107 supports a programmable interface to microprocessors implementing the

PowerPC architecture operating at bus frequencies up to 100 MHz. The PC107

processor interface allows for a variety of system configurations by providing support for

a second processor and a local bus slave.

60x Bus

Data Path

ECC/Pariy

Unit

Memory

Data

Processor

Interface Unit

DMA

Central

Control Unit

Memory

Controller

Memory

Add/Cntl

Mem Clocks

PCI

Interface Unit

IRQs

PLL

EPIC

ATU

Timers

Arbiter

Buffer

PCI Clocks

DLL

Clock In

PCI Bus

REQ/GNT

OSC

PC107 - Rev.5 – 01/04

PCX107AMZFU100LC相似产品对比

	PCX107AMZFU100LC	PCX107AVZFU100LC	PCX107AVZFU100LD	PCX107AMZFU100LD	PCX107AMGH100LD	PCX107AVGH100LD
描述	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-503	Multifunction Peripheral, CMOS, CBGA503, 33 X 33 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-503	Multifunction Peripheral, CMOS, CBGA503, 33 X 33 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-503
厂商名称	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
针数	503	503	503	503	503	503
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
其他特性	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES
总线兼容性	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X	POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X
最大时钟频率	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz
外部数据总线宽度	64	64	64	64	64	64
JESD-30 代码	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-CBGA-B503	S-CBGA-B503
长度	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm
端子数量	503	503	503	503	503	503
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.75 mm	2.75 mm	2.75 mm	2.75 mm	3.2 mm	3.2 mm
最大供电电压	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
最小供电电压	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
标称供电电压	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm

PCX107AMZFU100LC

PCX107AMZFU100LC概述

PCX107AMZFU100LC规格参数

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