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Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> IXDI509D1

IXDI509D1: 产品描述Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO6, 4 X 5 MM, ROHS COMPLIANT, DFN-6; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小351KB，共12页; 制造商IXYS; 标准

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IXDI509D1概述

Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO6, 4 X 5 MM, ROHS COMPLIANT, DFN-6

IXDI509D1规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	IXYS
零件包装代码	DFN
包装说明	4 X 5 MM, ROHS COMPLIANT, DFN-6
针数	6
Reach Compliance Code	compliant
ECCN代码	EAR99
高边驱动器	NO
接口集成电路类型	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码	R-PDSO-N6
长度	5 mm
功能数量	1
端子数量	6
最高工作温度	125 °C
最低工作温度	-55 °C
标称输出峰值电流	9 A
封装主体材料	PLASTIC/EPOXY
封装代码	HSON
封装等效代码	SOLCC6,.2,40
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	4.5/30 V
认证状态	Not Qualified
座面最大高度	0.95 mm
最大供电电压	30 V
最小供电电压	4.5 V
标称供电电压	18 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子节距	1 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
断开时间	0.04 µs
接通时间	0.055 µs
宽度	3.99 mm

IXDI509D1相似产品对比

	IXDI509D1	IXDI509SIA	IXDI509SIAT/R	IXDN509D1T/R	IXDI509D1T/R	IXDN509PI	IXDI509PI	IXDN509SIA	IXDN509SIAT/R
描述	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO6, 4 X 5 MM, ROHS COMPLIANT, DFN-6	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO6, 4 X 5 MM, ROHS COMPLIANT, DFN-6	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO6, 4 X 5 MM, ROHS COMPLIANT, DFN-6	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDIP8, 0.300 INCH, ROHS COMPLIANT, MS-001BA, PLASTIC, DIP-8	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDIP8, 0.300 INCH, ROHS COMPLIANT, MS-001BA, PLASTIC, DIP-8	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8	Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS
零件包装代码	DFN	SOIC	SOIC	DFN	DFN	DIP	DIP	SOIC	SOIC
包装说明	4 X 5 MM, ROHS COMPLIANT, DFN-6	0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8	0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8	4 X 5 MM, ROHS COMPLIANT, DFN-6	4 X 5 MM, ROHS COMPLIANT, DFN-6	DIP, DIP8,.3	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25
针数	6	8	8	6	6	8	8	8	8
Reach Compliance Code	compliant	unknown	unknown	compliant	compliant	compliant	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
高边驱动器	NO	NO	NO	NO	NO	NO	NO	NO	NO
接口集成电路类型	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码	R-PDSO-N6	R-PDSO-G8	R-PDSO-G8	R-PDSO-N6	R-PDSO-N6	R-PDIP-T8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8
长度	5 mm	4.9 mm	4.9 mm	5 mm	5 mm	9.59 mm	9.59 mm	4.9 mm	4.9 mm
功能数量	1	1	1	1	1	1	1	1	1
端子数量	6	8	8	6	6	8	8	8	8
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
标称输出峰值电流	9 A	9 A	9 A	9 A	9 A	9 A	9 A	9 A	9 A
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HSON	SOP	SOP	HSON	HSON	DIP	DIP	SOP	SOP
封装等效代码	SOLCC6,.2,40	SOP8,.25	SOP8,.25	SOLCC6,.2,40	SOLCC6,.2,40	DIP8,.3	DIP8,.3	SOP8,.25	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE, HEAT SINK/SLUG	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V	4.5/30 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	0.95 mm	1.75 mm	1.75 mm	0.95 mm	0.95 mm	4.57 mm	4.57 mm	1.75 mm	1.75 mm
最大供电电压	30 V	30 V	30 V	30 V	30 V	30 V	30 V	30 V	30 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V
表面贴装	YES	YES	YES	YES	YES	NO	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	NO LEAD	GULL WING	GULL WING	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
端子节距	1 mm	1.27 mm	1.27 mm	1 mm	1 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
断开时间	0.04 µs	0.04 µs	0.04 µs	0.04 µs	0.04 µs	0.04 µs	0.04 µs	0.04 µs	0.04 µs
接通时间	0.055 µs	0.055 µs	0.055 µs	0.055 µs	0.055 µs	0.055 µs	0.055 µs	0.055 µs	0.055 µs
宽度	3.99 mm	3.9 mm	3.9 mm	3.99 mm	3.99 mm	7.62 mm	7.62 mm	3.9 mm	3.9 mm

IXDI509D1

IXDI509D1在线购买

IXDI509D1概述

IXDI509D1规格参数

IXDI509D1相似产品对比

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