Standard SRAM, 128KX16, 12ns, CMOS, PQFP44, PLASTIC, TQFP-44
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| Factory Lead Time | 1 week |
| 最长访问时间 | 12 ns |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e0 |
| 长度 | 10 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 宽度 | 10 mm |
| CY7C1011CV33-12AIT | CY7C1011CV33-15ACT | CY7C1011CV33-12BVCT | CY7C1011CV33-15ZCT | CY7C1011CV33-15ZIT | |
|---|---|---|---|---|---|
| 描述 | Standard SRAM, 128KX16, 12ns, CMOS, PQFP44, PLASTIC, TQFP-44 | Standard SRAM, 128KX16, 15ns, CMOS, PQFP44, PLASTIC, TQFP-44 | Standard SRAM, 128KX16, 12ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, VFBGA-48 | Standard SRAM, 128KX16, 15ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 15ns, CMOS, PDSO44, TSOP2-44 |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | QFP | QFP | BGA | TSOP2 | TSOP2 |
| 包装说明 | LQFP, | LQFP, | VFBGA, | TSOP2, | TSOP2, |
| 针数 | 44 | 44 | 48 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 12 ns | 15 ns | 12 ns | 15 ns | 15 ns |
| JESD-30 代码 | S-PQFP-G44 | S-PQFP-G44 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 |
| 长度 | 10 mm | 10 mm | 8 mm | 18.415 mm | 18.415 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 48 | 44 | 44 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | VFBGA | TSOP2 | TSOP2 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1 mm | 1.194 mm | 1.194 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | BOTTOM | DUAL | DUAL |
| 宽度 | 10 mm | 10 mm | 6 mm | 10.16 mm | 10.16 mm |
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