DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Infineon(英飞凌) |
包装说明 | HERMETIC SEALED PACKAGE-12 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
最大输入电压 | 400 V |
最小输入电压 | 160 V |
标称输入电压 | 270 V |
JESD-30 代码 | R-CDMA-P12 |
JESD-609代码 | e0 |
长度 | 63.5 mm |
功能数量 | 1 |
输出次数 | 1 |
端子数量 | 12 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最大输出电流 | 4 A |
最大输出电压 | 25.25 V |
最小输出电压 | 24.75 V |
标称输出电压 | 25 V |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装等效代码 | MODULE,12LEAD,3.0 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Qualified |
筛选级别 | MIL-PRF-38534 Class H |
座面最大高度 | 9.65 mm |
表面贴装 | NO |
技术 | HYBRID |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG |
端子节距 | 5.08 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
最大总功率输出 | 100 W |
微调/可调输出 | NO |
宽度 | 38.1 mm |
5962-0623101HZA | 5962-0623101HYA | 5962-0623101HZC | 5962-0623101HXC | 5962-0623101HYC | 5962-0623101HXA | 5962-0623101HUA | 5962-0623101HUC | |
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描述 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 | DC-DC Regulated Power Supply Module, 1 Output, 100W, Hybrid, HERMETIC SEALED PACKAGE-12 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
包装说明 | HERMETIC SEALED PACKAGE-12 | HERMETIC SEALED PACKAGE-12 | HERMETIC SEALED PACKAGE-12 | , FLANGE MT,1.5X3.0 | , MODULE,12LEAD,3.0 | , FLANGE MT,1.5X3.0 | HERMETIC SEALED PACKAGE-12 | HERMETIC SEALED PACKAGE-12 |
Reach Compliance Code | unknown | unknown | compliant | compliant | compliant | compliant | unknown | unknown |
模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
最大输入电压 | 400 V | 400 V | 400 V | 400 V | 400 V | 400 V | 400 V | 400 V |
最小输入电压 | 160 V | 160 V | 160 V | 160 V | 160 V | 160 V | 160 V | 160 V |
标称输入电压 | 270 V | 270 V | 270 V | 270 V | 270 V | 270 V | 270 V | 270 V |
JESD-30 代码 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 | R-CDMA-P12 |
JESD-609代码 | e0 | e0 | e4 | e4 | e4 | e0 | e0 | e4 |
长度 | 63.5 mm | 63.5 mm | 63.5 mm | 63.5 mm | 63.5 mm | 63.5 mm | 63.5 mm | 63.5 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
最大输出电流 | 4 A | 4 A | 4 A | 4 A | 4 A | 4 A | 4 A | 4 A |
最大输出电压 | 25.25 V | 25.25 V | 25.25 V | 25.25 V | 25.25 V | 25.25 V | 25.25 V | 25.25 V |
最小输出电压 | 24.75 V | 24.75 V | 24.75 V | 24.75 V | 24.75 V | 24.75 V | 24.75 V | 24.75 V |
标称输出电压 | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装等效代码 | MODULE,12LEAD,3.0 | MODULE,12LEAD,3.0 | MODULE,12LEAD,3.0 | FLANGE MT,1.5X3.0 | MODULE,12LEAD,3.0 | FLANGE MT,1.5X3.0 | MODULE,12LEAD,3.0 | MODULE,12LEAD,3.0 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
筛选级别 | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H | MIL-PRF-38534 Class H |
座面最大高度 | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm | 9.65 mm |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Gold (Au) | Gold (Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
最大总功率输出 | 100 W | 100 W | 100 W | 100 W | 100 W | 100 W | 100 W | 100 W |
微调/可调输出 | NO | NO | NO | NO | NO | NO | NO | NO |
宽度 | 38.1 mm | 38.1 mm | 38.1 mm | 38.1 mm | 38.1 mm | 38.1 mm | 38.1 mm | 38.1 mm |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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