Switched Capacitor Filter, 1 Func, Lowpass, BICMOS, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28, |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
有源滤波器类型 | SWITCHED CAPACITOR FILTER |
JESD-30 代码 | S-XQCC-N28 |
JESD-609代码 | e0 |
长度 | 4 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 |
认证状态 | Not Qualified |
响应 | LOWPASS |
座面最大高度 | 0.8 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 0.4 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
MAX7472UTI | MAX7472UTI+ | MAX7472UTI-T | |
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描述 | Switched Capacitor Filter, 1 Func, Lowpass, BICMOS, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28, | Switched Capacitor Filter, 1 Func, Lowpass, BICMOS, 4 X 4 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WGGE, TQFN-28, | Switched Capacitor Filter, 1 Func, Lowpass, BICMOS, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28, |
是否Rohs认证 | 不符合 | 符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | QFN | QFN |
包装说明 | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28, | 4 X 4 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WGGE, TQFN-28, | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGE, TQFN-28, |
针数 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | unknown | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
有源滤波器类型 | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER |
JESD-30 代码 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
长度 | 4 mm | 4 mm | 4 mm |
湿度敏感等级 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 | 260 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
响应 | LOWPASS | LOWPASS | LOWPASS |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.4 mm | 0.4 mm | 0.4 mm |
端子位置 | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 4 mm | 4 mm |
JESD-609代码 | e0 | e3 | - |
端子面层 | TIN LEAD | Matte Tin (Sn) | - |
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