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IDT74FCT16823CTPAG

产品描述Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, TSSOP-56
产品类别逻辑    逻辑   
文件大小76KB,共7页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT74FCT16823CTPAG概述

Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, TSSOP-56

IDT74FCT16823CTPAG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TSSOP
包装说明TSSOP,
针数56
Reach Compliance Codecompliant
其他特性WITH CLEAR AND CLOCK ENABLE
系列FCT
JESD-30 代码R-PDSO-G56
JESD-609代码e3
长度14 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数9
功能数量2
端口数量2
端子数量56
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)12.5 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度6.1 mm

文档预览

下载PDF文档
IDT74FCT16823AT/CT/ET
FAST CMOS 18-BIT REGISTER
INDUSTRIAL TEMPERATURE RANGE
FAST CMOS 18-BIT
REGISTER
IDT74FCT16823AT/CT/ET
FEATURES:
0.5 MICRON CMOS Technology
High-speed, low-power CMOS replacement for ABT functions
Typical t
SK(o)
(Output Skew) < 250ps
Low input and output leakage
1µA (max.)
V
CC
= 5V ± 10%
High drive outputs (-32mA I
OH
, 64mA I
OL
)
Power off disable outputs permit “live insertion”
Typical V
OLP
(Output Ground Bounce) < 1.0V at V
CC
= 5V,
T
A
= 25°C
• Available in SSOP and TSSOP packages
DESCRIPTION:
The FCT16823T 18-bit bus interface registers are built using advanced,
dual metal CMOS technology. These high-speed, low-power registers with
clock enable (xCLKEN) and clear (xCLR) controls are ideal for parity bus
interfacing in high-performance synchronous systems. The control inputs
are organized to operate the device as two 9-bit registers or one 18-bit
register. Flow-through organization of signal pins simplifies layout. All inputs
are designed with hysteresis for improved noise margin.
The FCT16823T is ideally suited for driving high-capacitance loads and
low-impedance backplanes. The output buffers are designed with power off
disable capability to allow "live insertion" of boards when used as backplane
drivers.
FUNCTIONAL BLOCK DIAGRAM
2
1
OE
1
CLR
1
CLK
55
1
CLKEN
2
CLKEN
1
56
2
CLK
2
OE
2
CLR
27
28
29
30
R
C
D
54
1
D
1
2
D
1
3
1
Q
1
42
R
C
D
15
2
Q
1
TO EIGHT OTHER CHANNELS
TO EIGHT OTHER CHANNELS
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
2002
Integrated Device Technology, Inc.
JUNE 2002
DSC-5438/3

IDT74FCT16823CTPAG相似产品对比

IDT74FCT16823CTPAG IDT74FCT16823CTPVG IDT74FCT16823ATPAG IDT74FCT16823ETPAG IDT74FCT16823ETPVG
描述 Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, TSSOP-56 Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, SSOP-56 Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, TSSOP-56 Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, TSSOP-56 Bus Driver, FCT Series, 2-Func, 9-Bit, True Output, CMOS, PDSO56, SSOP-56
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TSSOP SSOP TSSOP TSSOP SSOP
包装说明 TSSOP, SSOP-56 TSSOP, TSSOP, SSOP-56
针数 56 56 56 56 56
Reach Compliance Code compliant compliant compliant compliant compliant
其他特性 WITH CLEAR AND CLOCK ENABLE WITH CLEAR AND CLOCK ENABLE WITH CLEAR AND CLOCK ENABLE WITH CLEAR AND CLOCK ENABLE WITH CLEAR AND CLOCK ENABLE
系列 FCT FCT FCT FCT FCT
JESD-30 代码 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56
JESD-609代码 e3 e3 e3 e3 e3
长度 14 mm 18.415 mm 14 mm 14 mm 18.415 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 1 1 1 1
位数 9 9 9 9 9
功能数量 2 2 2 2 2
端口数量 2 2 2 2 2
端子数量 56 56 56 56 56
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SSOP TSSOP TSSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260
传播延迟(tpd) 12.5 ns 12.5 ns 20 ns 8 ns 8 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 2.794 mm 1.2 mm 1.2 mm 2.794 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.635 mm 0.5 mm 0.5 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30
宽度 6.1 mm 7.5 mm 6.1 mm 6.1 mm 7.5 mm

 
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