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BUH50AK

产品描述4A, 500V, NPN, Si, POWER TRANSISTOR, TO-220AB, 3 PIN
产品类别分立半导体    晶体管   
文件大小182KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 全文预览

BUH50AK概述

4A, 500V, NPN, Si, POWER TRANSISTOR, TO-220AB, 3 PIN

BUH50AK规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称ON Semiconductor(安森美)
零件包装代码TO-220AB
包装说明TO-220AB, 3 PIN
针数3
Reach Compliance Codecompliant
ECCN代码EAR99
外壳连接COLLECTOR
最大集电极电流 (IC)4 A
集电极-发射极最大电压500 V
配置SINGLE
最小直流电流增益 (hFE)5
JESD-30 代码R-PSFM-T3
JESD-609代码e0
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型NPN
认证状态Not Qualified
表面贴装NO
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON
标称过渡频率 (fT)4 MHz

文档预览

下载PDF文档
BUH50G
SWITCHMODE NPN Silicon
Planar Power Transistor
The BUH50G has an application specific state−of−art die designed
for use in 50 W HALOGEN electronic transformers and
SWITCHMODE applications.
Features
http://onsemi.com
Improved Efficiency Due to Low Base Drive Requirements:
High and Flat DC Current Gain h
FE
Fast Switching
ON Semiconductor Six Sigma Philosophy Provides Tight and
Reproductible Parametric Distributions
Specified Dynamic Saturation Data
Full Characterization at 125°C
These Devices are Pb−Free and are RoHS Compliant*
POWER TRANSISTOR
4 AMPERES
800 VOLTS, 50 WATTS
COLLECTOR
2,4
1
BASE
3
EMITTER
MAXIMUM RATINGS
Rating
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
Collector−Emitter Breakdown Voltage
Emitter−Base Voltage
Collector Current
Collector Current
Base Current
Base Current
Continuous
Peak (Note 1)
Continuous
Peak (Note 1)
Symbol
V
CEO
V
CBO
V
CES
V
EBO
I
C
I
CM
I
B
I
BM
P
D
T
J
, T
stg
Value
500
800
800
9
4
8
2
4
50
0.4
−65
to 150
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Adc
Adc
Adc
W
W/_C
_C
1
2
3
4
TO−220AB
CASE 221A−09
STYLE 1
Total Device Dissipation @ T
C
= 25_C
Derate above 25°C
Operating and Storage Temperature
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle
10%.
BUH50G
AY WW
THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
Symbol
R
qJC
R
qJA
T
L
Max
2.5
62.5
260
Unit
_C/W
_C/W
_C
BUH50
A
Y
WW
G
1
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
Package
TO−220
(Pb−Free)
Shipping
50 Units / Rail
BUH50G
August, 2013
Rev. 7
1
Publication Order Number:
BUH50/D

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